| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
|
DISTI #
98AC6155
|
Newark | Safety Power Management Ic, Qfn56/ Tray Rohs Compliant: Yes |Nxp MC33FS8510A2ES RoHS: Compliant Min Qty: 260 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
$6.1900 / $6.3700 | Buy Now | |
|
DISTI #
568-MC33FS8510A2ES-ND
|
DigiKey | SYSTEM BASIS CHIP FS8500 Min Qty: 260 Lead time: 16 Weeks Container: Tray | Temporarily Out of Stock |
|
$7.8091 | Buy Now | |
|
DISTI #
MC33FS8510A2ES
|
Avnet Americas | Fail-Safe System Basis Chip with Multiple SMPS and LDO 56-Pin HVQFN - Trays (Alt: MC33FS8510A2ES) Min Qty: 780 Package Multiple: 260 Lead time: 16 Weeks, 0 Days Container: Tray | 0 |
|
RFQ | ||
|
DISTI #
771-MC33FS8510A2ES
|
Mouser Electronics | Power Management Specialized - PMIC Safety power management IC, QFN56 RoHS: Compliant | 0 |
|
$6.2000 / $7.8000 | Order Now | |
| Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 780 Package Multiple: 260 Lead time: 16 Weeks Container: Tray | 0Tray |
|
$5.5500 | Buy Now | ||
|
DISTI #
MC33FS8510A2ES
|
Avnet Silica | Fail-Safe System Basis Chip with Multiple SMPS and LDO 56-Pin HVQFN (Alt: MC33FS8510A2ES) RoHS: Compliant Min Qty: 260 Package Multiple: 260 Lead time: 18 Weeks, 0 Days | Silica - 0 |
|
Buy Now |
|
|
|
|---|---|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Active
|
|
Ihs Manufacturer
|
NXP SEMICONDUCTORS
|
|
Package Description
|
HVQFN-56
|
|
Reach Compliance Code
|
compliant
|
|
Factory Lead Time
|
16 Weeks
|
|
Samacsys Manufacturer
|
NXP
|
|
Adjustable Threshold
|
NO
|
|
Analog IC - Other Type
|
SYSTEM BASIS CHIP
|
|
JESD-30 Code
|
S-PQCC-N56
|
|
JESD-609 Code
|
e3
|
|
Length
|
8 mm
|
|
Moisture Sensitivity Level
|
3
|
|
Number of Channels
|
6
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
56
|
|
Operating Temperature-Max
|
125 °C
|
|
Operating Temperature-Min
|
-40 °C
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
HVQCCN
|
|
Package Equivalence Code
|
LCC56,.31SQ,20
|
|
Package Shape
|
SQUARE
|
|
Package Style
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
|
Peak Reflow Temperature (Cel)
|
260
|
|
Screening Level
|
AEC-Q100
|
|
Seated Height-Max
|
1 mm
|
|
Supply Current-Max (Isup)
|
25 mA
|
|
Supply Voltage-Max (Vsup)
|
36 V
|
|
Supply Voltage-Min (Vsup)
|
5.1 V
|
|
Surface Mount
|
YES
|
|
Terminal Finish
|
Tin (Sn)
|
|
Terminal Form
|
NO LEAD
|
|
Terminal Pitch
|
0.5 mm
|
|
Terminal Position
|
QUAD
|
|
Threshold Voltage-Nom
|
+7.5V
|
|
Time@Peak Reflow Temperature-Max (s)
|
40
|
|
Width
|
8 mm
|
