Part Details for MC68HC08AZ32ACFUE by Freescale Semiconductor
Overview of MC68HC08AZ32ACFUE by Freescale Semiconductor
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Part Details for MC68HC08AZ32ACFUE
MC68HC08AZ32ACFUE CAD Models
MC68HC08AZ32ACFUE Part Data Attributes
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MC68HC08AZ32ACFUE
Freescale Semiconductor
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MC68HC08AZ32ACFUE
Freescale Semiconductor
8-BIT, EEPROM, 8.4MHz, MICROCONTROLLER, PQFP64, 14 X 14 MM, ROHS COMPLIANT, QFP-64
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
| Part Package Code | QFP | |
| Package Description | 14 X 14 MM, ROHS COMPLIANT, QFP-64 | |
| Pin Count | 64 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.31.00.01 | |
| Has ADC | YES | |
| Address Bus Width | ||
| Bit Size | 8 | |
| CPU Family | 68HC08 | |
| Clock Frequency-Max | 8 MHz | |
| DAC Channels | NO | |
| DMA Channels | YES | |
| External Data Bus Width | ||
| JESD-30 Code | S-PQFP-G64 | |
| Length | 14 mm | |
| Number of I/O Lines | 50 | |
| Number of Terminals | 64 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP64,.66SQ,32 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| RAM (bytes) | 1024 | |
| ROM (words) | 32256 | |
| ROM Programmability | EEPROM | |
| Seated Height-Max | 2.45 mm | |
| Speed | 8.4 MHz | |
| Supply Current-Max | 30 mA | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| Supply Voltage-Nom | 5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 14 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |