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Overview of MC68HC711KA4MFS3 by Freescale Semiconductor
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- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for MC68HC711KA4MFS3 by Freescale Semiconductor
Part Data Attributes for MC68HC711KA4MFS3 by Freescale Semiconductor
|
|
---|---|
Rohs Code
|
No
|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
Package Description
|
QCCJ, LDCC68,1.0SQ
|
Reach Compliance Code
|
unknown
|
Bit Size
|
8
|
CPU Family
|
6800
|
JESD-30 Code
|
S-XQCC-J68
|
JESD-609 Code
|
e0
|
Number of Terminals
|
68
|
Operating Temperature-Max
|
125 °C
|
Operating Temperature-Min
|
-40 °C
|
Package Body Material
|
CERAMIC
|
Package Code
|
QCCJ
|
Package Equivalence Code
|
LDCC68,1.0SQ
|
Package Shape
|
SQUARE
|
Package Style
|
CHIP CARRIER
|
Qualification Status
|
Not Qualified
|
RAM (bytes)
|
768
|
ROM (words)
|
24576
|
ROM Programmability
|
UVPROM
|
Speed
|
3 MHz
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
AUTOMOTIVE
|
Terminal Finish
|
Tin/Lead (Sn/Pb)
|
Terminal Form
|
J BEND
|
Terminal Pitch
|
1.27 mm
|
Terminal Position
|
QUAD
|