Part Details for MC7447AVS1167NB by Freescale Semiconductor
Overview of MC7447AVS1167NB by Freescale Semiconductor
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for MC7447AVS1167NB
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2156-MC7447AVS1167NB-ND
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DigiKey | IC MPU MPC74XX 1.167GHZ 360LGA Min Qty: 1 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT |
572 In Stock |
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$323.5000 | Buy Now |
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Rochester Electronics | MC7447 - RISC Microprocessor, 32-Bit, PowerPC RoHS: Compliant Status: Obsolete Min Qty: 1 | 572 |
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$277.6200 / $326.6100 | Buy Now |
Part Details for MC7447AVS1167NB
MC7447AVS1167NB CAD Models
MC7447AVS1167NB Part Data Attributes
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MC7447AVS1167NB
Freescale Semiconductor
Buy Now
Datasheet
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Compare Parts:
MC7447AVS1167NB
Freescale Semiconductor
A7PM PB FREE
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Pbfree Code | No | |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
Part Package Code | LGA | |
Package Description | 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, CERAMIC, LGA-360 | |
Pin Count | 360 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.A.1 | |
HTS Code | 8542.31.00.01 | |
Additional Feature | ALSO REQUIRES 1.8V OR 2.5V SUPPLY | |
Address Bus Width | 36 | |
Bit Size | 32 | |
Boundary Scan | YES | |
Clock Frequency-Max | 167 MHz | |
External Data Bus Width | 64 | |
Format | FLOATING POINT | |
Integrated Cache | YES | |
JESD-30 Code | S-CBGA-X360 | |
Length | 25 mm | |
Low Power Mode | YES | |
Moisture Sensitivity Level | 1 | |
Number of Terminals | 360 | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | CGA | |
Package Equivalence Code | LGA360,19X19,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 2.2 mm | |
Speed | 1167 MHz | |
Supply Voltage-Max | 1.35 V | |
Supply Voltage-Min | 1.25 V | |
Supply Voltage-Nom | 1.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Form | UNSPECIFIED | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 25 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for MC7447AVS1167NB
This table gives cross-reference parts and alternative options found for MC7447AVS1167NB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MC7447AVS1167NB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
PPC7448HX1250NC | 32-BIT, 1250MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360 | Freescale Semiconductor | MC7447AVS1167NB vs PPC7448HX1250NC |
TSPC750AVGB/Q12LE | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, CERAMIC, BGA-360 | Thales Group | MC7447AVS1167NB vs TSPC750AVGB/Q12LE |
PPC7448HX800NC | 32-BIT, 800MHz, RISC PROCESSOR, CBGA360 | NXP Semiconductors | MC7447AVS1167NB vs PPC7448HX800NC |
TSXPC750AMGSU8LE | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 | Atmel Corporation | MC7447AVS1167NB vs TSXPC750AMGSU8LE |
IBM25PPC740-DB0M2000 | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 | IBM | MC7447AVS1167NB vs IBM25PPC740-DB0M2000 |
IBM25PPC750L-GB433A2T | RISC Microprocessor, 32-Bit, 433MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 | IBM | MC7447AVS1167NB vs IBM25PPC750L-GB433A2T |
TSPC750AMGSB/Q12LE | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 | Atmel Corporation | MC7447AVS1167NB vs TSPC750AMGSB/Q12LE |
PPC7448VU1000LD | 32-BIT, 1000MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.40 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, CERAMIC, BGA-360 | Freescale Semiconductor | MC7447AVS1167NB vs PPC7448VU1000LD |
PC7410VG450LE | RISC Microprocessor, 32-Bit, 450MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Atmel Corporation | MC7447AVS1167NB vs PC7410VG450LE |
PPC7448HX1000LC | 32-BIT, 1000MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.40 MM HEIGHT, 1.27 MM PITC, CERAMIC, BGA-360 | Freescale Semiconductor | MC7447AVS1167NB vs PPC7448HX1000LC |