Part Details for MC860ENCVR50D4R2 by Freescale Semiconductor
Overview of MC860ENCVR50D4R2 by Freescale Semiconductor
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for MC860ENCVR50D4R2
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2156-MC860ENCVR50D4R2-ND
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DigiKey | IC MPU MPC8XX 50MHZ 357BGA Min Qty: 4 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT |
669 In Stock |
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$76.0000 | Buy Now |
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Rochester Electronics | MC860 - RISC Microprocessor, 32-Bit, Power Architecture RoHS: Compliant Status: Obsolete Min Qty: 1 | 669 |
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$65.2200 / $76.7300 | Buy Now |
Part Details for MC860ENCVR50D4R2
MC860ENCVR50D4R2 CAD Models
MC860ENCVR50D4R2 Part Data Attributes
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MC860ENCVR50D4R2
Freescale Semiconductor
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Datasheet
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MC860ENCVR50D4R2
Freescale Semiconductor
PowerQUICC, 32 Bit Power Architecture SoC, 50MHz, CPM, ENET, HDLC, PCMCIA, -40 to 95C
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
Package Description | 25 X 25 MM, 1.20 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, PLASTIC, BGA-357 | |
Reach Compliance Code | compliant | |
Address Bus Width | 32 | |
Bit Size | 32 | |
Boundary Scan | YES | |
Clock Frequency-Max | 50 MHz | |
External Data Bus Width | 32 | |
Format | FIXED POINT | |
Integrated Cache | YES | |
JESD-30 Code | S-PBGA-B357 | |
JESD-609 Code | e1 | |
Length | 25 mm | |
Low Power Mode | YES | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 357 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HBGA | |
Package Equivalence Code | BGA357,19X19,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, HEAT SINK/SLUG | |
Peak Reflow Temperature (Cel) | 245 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 2.52 mm | |
Speed | 50 MHz | |
Supply Voltage-Max | 3.465 V | |
Supply Voltage-Min | 3.135 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 25 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |