Part Details for MC8641VJ1000NE by NXP Semiconductors
Overview of MC8641VJ1000NE by NXP Semiconductors
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Price & Stock for MC8641VJ1000NE
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
85AK8672
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Newark | Mc8641Vj1000Ne Rohs Compliant: Yes |Nxp MC8641VJ1000NE Min Qty: 24 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
$520.8200 / $552.6300 | Buy Now |
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|
Flip Electronics | Stock, ship today | 24 |
|
$397.5800 | RFQ |
Part Details for MC8641VJ1000NE
MC8641VJ1000NE CAD Models
MC8641VJ1000NE Part Data Attributes:
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MC8641VJ1000NE
NXP Semiconductors
Buy Now
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Compare Parts:
MC8641VJ1000NE
NXP Semiconductors
RISC PROCESSOR
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | BGA, | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.1 | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 2 Days | |
| Address Bus Width | 16 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| External Data Bus Width | 64 | |
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-CBGA-B1023 | |
| JESD-609 Code | e2 | |
| Length | 33 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 1023 | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | ||
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 245 | |
| Seated Height-Max | 2.77 mm | |
| Speed | 1000 MHz | |
| Supply Voltage-Max | 1 V | |
| Supply Voltage-Min | 0.9 V | |
| Supply Voltage-Nom | 0.95 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | Tin/Silver (Sn/Ag) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 33 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |