Part Details for MC9S08GW64CLKR by Freescale Semiconductor
Overview of MC9S08GW64CLKR by Freescale Semiconductor
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Part Details for MC9S08GW64CLKR
MC9S08GW64CLKR CAD Models
MC9S08GW64CLKR Part Data Attributes
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MC9S08GW64CLKR
Freescale Semiconductor
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Datasheet
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MC9S08GW64CLKR
Freescale Semiconductor
S08GW 8-bit MCU, S08 core, 64KB Flash, 20MHz, QFP 80
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
Package Description | 14 X 14 MM, ROHS COMPLIANT, LQFP-80 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Samacsys Manufacturer | NXP | |
Has ADC | YES | |
Additional Feature | ALSO OPERATES WITH 1.8 V MINIMUM SUPPLY AT 10 MHZ | |
Address Bus Width | ||
Bit Size | 8 | |
Clock Frequency-Max | 16 MHz | |
DAC Channels | NO | |
DMA Channels | NO | |
External Data Bus Width | ||
JESD-30 Code | S-PQFP-G80 | |
JESD-609 Code | e3 | |
Length | 14 mm | |
Moisture Sensitivity Level | 3 | |
Number of I/O Lines | 56 | |
Number of Terminals | 80 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
PWM Channels | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LQFP | |
Package Shape | SQUARE | |
Package Style | FLATPACK, LOW PROFILE | |
Peak Reflow Temperature (Cel) | 260 | |
ROM (words) | 65536 | |
ROM Programmability | FLASH | |
Seated Height-Max | 1.6 mm | |
Speed | 20 MHz | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 2.15 V | |
Supply Voltage-Nom | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.65 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 14 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |