Part Details for MC9S08SH16CTG by Freescale Semiconductor
Overview of MC9S08SH16CTG by Freescale Semiconductor
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Industrial Automation
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Automotive
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Renewable Energy
Entertainment and Gaming
Robotics and Drones
Price & Stock for MC9S08SH16CTG
Part # | Distributor | Description | Stock | Price | Buy | |
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Rochester Electronics | MC9S08SH - Microcontroller, 8-Bit, HC08/S08 CPU, FLASH, 40MHz, CMOS RoHS: Compliant Status: Active Min Qty: 1 | 1889 |
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$3.5600 / $4.1900 | Buy Now |
Part Details for MC9S08SH16CTG
MC9S08SH16CTG CAD Models
MC9S08SH16CTG Part Data Attributes
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MC9S08SH16CTG
Freescale Semiconductor
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Datasheet
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MC9S08SH16CTG
Freescale Semiconductor
S08SH 8-bit MCU, S08 core, 16KB Flash, 40MHz, SOP 16
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
Package Description | TSSOP-16 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.31.00.01 | |
Samacsys Manufacturer | NXP | |
Has ADC | YES | |
Address Bus Width | ||
Bit Size | 8 | |
Clock Frequency-Max | 40 MHz | |
DAC Channels | NO | |
DMA Channels | NO | |
External Data Bus Width | ||
JESD-30 Code | R-PDSO-G16 | |
JESD-609 Code | e3 | |
Length | 5 mm | |
Moisture Sensitivity Level | 3 | |
Number of I/O Lines | 14 | |
Number of Terminals | 16 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
PWM Channels | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TSSOP | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
RAM (bytes) | 1024 | |
ROM (words) | 16384 | |
ROM Programmability | FLASH | |
Screening Level | AEC-Q100 | |
Seated Height-Max | 1.2 mm | |
Speed | 40 MHz | |
Supply Voltage-Max | 5.5 V | |
Supply Voltage-Min | 2.7 V | |
Supply Voltage-Nom | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.65 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 4.4 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |