| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
| Chip 1 Exchange | INSTOCK | 40 |
|
RFQ |
|
|
|
|---|---|
|
Pbfree Code
|
Yes
|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Transferred
|
|
Ihs Manufacturer
|
FREESCALE SEMICONDUCTOR INC
|
|
Part Package Code
|
SSOP
|
|
Package Description
|
TSSOP-28
|
|
Pin Count
|
28
|
|
Reach Compliance Code
|
compliant
|
|
ECCN Code
|
3A991.A.2
|
|
HTS Code
|
8542.31.00.01
|
|
Samacsys Manufacturer
|
NXP
|
|
Has ADC
|
YES
|
|
Address Bus Width
|
|
|
Bit Size
|
8
|
|
CPU Family
|
HCS08
|
|
Clock Frequency-Max
|
16 MHz
|
|
DAC Channels
|
NO
|
|
DMA Channels
|
NO
|
|
External Data Bus Width
|
|
|
JESD-30 Code
|
R-PDSO-G28
|
|
JESD-609 Code
|
e3
|
|
Length
|
9.7 mm
|
|
Moisture Sensitivity Level
|
3
|
|
Number of I/O Lines
|
22
|
|
Number of Terminals
|
28
|
|
On Chip Program ROM Width
|
8
|
|
Operating Temperature-Max
|
85 °C
|
|
Operating Temperature-Min
|
-40 °C
|
|
PWM Channels
|
YES
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
TSSOP
|
|
Package Equivalence Code
|
TSSOP28,.25
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
|
Peak Reflow Temperature (Cel)
|
260
|
|
Qualification Status
|
Not Qualified
|
|
RAM (bytes)
|
512
|
|
ROM (words)
|
16384
|
|
ROM Programmability
|
FLASH
|
|
Seated Height-Max
|
1.2 mm
|
|
Speed
|
20 MHz
|
|
Supply Current-Max
|
15 mA
|
|
Supply Voltage-Max
|
5.5 V
|
|
Supply Voltage-Min
|
2.7 V
|
|
Supply Voltage-Nom
|
3 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
INDUSTRIAL
|
|
Terminal Finish
|
MATTE TIN
|
|
Terminal Form
|
GULL WING
|
|
Terminal Pitch
|
0.65 mm
|
|
Terminal Position
|
DUAL
|
|
Time@Peak Reflow Temperature-Max (s)
|
40
|
|
Width
|
4.4 mm
|
|
uPs/uCs/Peripheral ICs Type
|
MICROCONTROLLER
|
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MC9S08SL16CTL | 8-BIT, FLASH, 20MHz, MICROCONTROLLER, PDSO28, TSSOP-28 | Rochester Electronics LLC | MC9S08SL16CTL vs MC9S08SL16CTL |