Part Details for MC9S12GC32CFAE by Freescale Semiconductor
Overview of MC9S12GC32CFAE by Freescale Semiconductor
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Part Details for MC9S12GC32CFAE
MC9S12GC32CFAE CAD Models
MC9S12GC32CFAE Part Data Attributes
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MC9S12GC32CFAE
Freescale Semiconductor
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Datasheet
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MC9S12GC32CFAE
Freescale Semiconductor
S12GC 16-bit MCU, HCS12 core, 32KB Flash, 50MHz, QFP 48
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
Package Description | LQFP-48 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.31.00.01 | |
Samacsys Manufacturer | NXP | |
Has ADC | YES | |
Address Bus Width | ||
Bit Size | 16 | |
Clock Frequency-Max | 50 MHz | |
DAC Channels | NO | |
DMA Channels | NO | |
External Data Bus Width | ||
JESD-30 Code | S-PQFP-G48 | |
JESD-609 Code | e3 | |
Length | 7 mm | |
Moisture Sensitivity Level | 3 | |
Number of I/O Lines | 31 | |
Number of Terminals | 48 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
PWM Channels | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFQFP | |
Package Shape | SQUARE | |
Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
RAM (bytes) | 2048 | |
ROM (words) | 32768 | |
ROM Programmability | FLASH | |
Seated Height-Max | 1.6 mm | |
Speed | 25 MHz | |
Supply Voltage-Max | 2.75 V | |
Supply Voltage-Min | 2.35 V | |
Supply Voltage-Nom | 2.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 7 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |