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Overview of MC9S12XDP512MPV by Motorola Semiconductor Products
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Industrial Automation
Transportation and Logistics
Renewable Energy
Automotive
Robotics and Drones
CAD Models for MC9S12XDP512MPV by Motorola Semiconductor Products
Part Data Attributes for MC9S12XDP512MPV by Motorola Semiconductor Products
|
|
---|---|
Rohs Code
|
No
|
Part Life Cycle Code
|
Transferred
|
Ihs Manufacturer
|
MOTOROLA INC
|
Package Description
|
QFP, QFP112,.87SQ
|
Reach Compliance Code
|
unknown
|
HTS Code
|
8542.31.00.01
|
Bit Size
|
16
|
CPU Family
|
CPU12
|
JESD-30 Code
|
S-PQFP-G112
|
Number of Terminals
|
112
|
Operating Temperature-Max
|
125 °C
|
Operating Temperature-Min
|
-40 °C
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
QFP
|
Package Equivalence Code
|
QFP112,.87SQ
|
Package Shape
|
SQUARE
|
Package Style
|
FLATPACK
|
Qualification Status
|
Not Qualified
|
RAM (bytes)
|
32768
|
ROM (words)
|
524288
|
ROM Programmability
|
FLASH
|
Speed
|
25 MHz
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
AUTOMOTIVE
|
Terminal Form
|
GULL WING
|
Terminal Pitch
|
0.635 mm
|
Terminal Position
|
QUAD
|
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