Part Details for MCF51JE256VML by Freescale Semiconductor
Overview of MCF51JE256VML by Freescale Semiconductor
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Price & Stock for MCF51JE256VML
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2156-MCF51JE256VML-ND
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DigiKey | IC MCU 32B 256KB FLASH 104MAPBGA Min Qty: 30 Container: Bulk MARKETPLACE PRODUCT |
960 In Stock |
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$10.0000 | Buy Now |
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Rochester Electronics | Microcontroller, 32-Bit, FLASH, COLDFIRE CPU, 50.33MHz, CMOS, PBGA104 RoHS: Compliant Status: Active Min Qty: 1 | 720 |
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$8.5900 / $10.1000 | Buy Now |
Part Details for MCF51JE256VML
MCF51JE256VML CAD Models
MCF51JE256VML Part Data Attributes
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MCF51JE256VML
Freescale Semiconductor
Buy Now
Datasheet
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MCF51JE256VML
Freescale Semiconductor
32-BIT, FLASH, 50.33MHz, MICROCONTROLLER, PBGA104, 10 X 10 MM, ROHS COMPLIANT, MAPBGA-104
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
Part Package Code | BGA | |
Package Description | 10 X 10 MM, ROHS COMPLIANT, MAPBGA-104 | |
Pin Count | 104 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Samacsys Manufacturer | NXP | |
Has ADC | YES | |
Address Bus Width | ||
Bit Size | 32 | |
CPU Family | COLDFIRE | |
Clock Frequency-Max | 16 MHz | |
DAC Channels | YES | |
DMA Channels | NO | |
External Data Bus Width | ||
JESD-30 Code | S-PBGA-B104 | |
Length | 10 mm | |
Moisture Sensitivity Level | 3 | |
Number of I/O Lines | 72 | |
Number of Terminals | 104 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 105 °C | |
Operating Temperature-Min | -40 °C | |
PWM Channels | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Equivalence Code | BGA104,11X11,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
RAM (bytes) | 32768 | |
ROM (words) | 262144 | |
ROM Programmability | FLASH | |
Seated Height-Max | 1.52 mm | |
Speed | 50.33 MHz | |
Supply Current-Max | 48 mA | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 1.8 V | |
Supply Voltage-Nom | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN SILVER COPPER OVER NICKEL | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 10 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |