Part Details for MCF51JE256VML by NXP Semiconductors
Overview of MCF51JE256VML by NXP Semiconductors
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Price & Stock for MCF51JE256VML
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
MCF51JE256VML-ND
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DigiKey | IC MCU 32B 256KB FLASH 104MAPBGA Min Qty: 1200 Lead time: 20 Weeks Container: Box | Limited Supply - Call |
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$7.7924 | Buy Now |
DISTI #
MCF51JE256VML
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Avnet Americas | MCU 32-bit MCF51JE ColdFire RISC 256KB Flash 2.5V/3.3V 104-Pin MAPBGA - Trays (Alt: MCF51JE256VML) RoHS: Compliant Min Qty: 37 Package Multiple: 1 Lead time: 4 Weeks, 0 Days Container: Tray | 960 Partner Stock |
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$8.5932 / $9.9099 | Buy Now |
DISTI #
MCF51JE256VML
|
Avnet Americas | MCU 32-bit MCF51JE ColdFire RISC 256KB Flash 2.5V/3.3V 104-Pin MAPBGA - Trays (Alt: MCF51JE256VML) RoHS: Compliant Min Qty: 1200 Package Multiple: 1200 Container: Tray | 0 |
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RFQ |
Part Details for MCF51JE256VML
MCF51JE256VML CAD Models
MCF51JE256VML Part Data Attributes
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MCF51JE256VML
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
MCF51JE256VML
NXP Semiconductors
32-BIT, FLASH, 50.33MHz, MICROCONTROLLER, PBGA104
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | 10 X 10 MM, ROHS COMPLIANT, MAPBGA-104 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Factory Lead Time | 4 Weeks | |
Samacsys Manufacturer | NXP | |
Has ADC | YES | |
Address Bus Width | ||
Bit Size | 32 | |
CPU Family | COLDFIRE | |
Clock Frequency-Max | 16 MHz | |
DAC Channels | YES | |
DMA Channels | NO | |
External Data Bus Width | ||
JESD-30 Code | S-PBGA-B104 | |
JESD-609 Code | e1 | |
Length | 10 mm | |
Moisture Sensitivity Level | 3 | |
Number of I/O Lines | 72 | |
Number of Terminals | 104 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 105 °C | |
Operating Temperature-Min | -40 °C | |
PWM Channels | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Equivalence Code | BGA104,11X11,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
RAM (bytes) | 32768 | |
ROM (words) | 262144 | |
ROM Programmability | FLASH | |
Seated Height-Max | 1.52 mm | |
Speed | 50.33 MHz | |
Supply Current-Max | 48 mA | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3 V | |
Supply Voltage-Nom | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 10 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |