Datasheets
MCF51MM256CML by:

MCF51MM 32-bit MCU, ColdFire V1 core, 256KB Flash, 50MHz, MAPBGA 104

Part Details for MCF51MM256CML by Freescale Semiconductor

Overview of MCF51MM256CML by Freescale Semiconductor

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Applications Consumer Electronics Industrial Automation Energy and Power Systems Renewable Energy Automotive Robotics and Drones

Price & Stock for MCF51MM256CML

Part # Distributor Description Stock Price Buy
Rochester Electronics Microcontroller, 32-Bit, FLASH, COLDFIRE CPU, 50.33MHz PBGA104 RoHS: Compliant Status: Obsolete Min Qty: 1 937
  • 1 $9.2100
  • 25 $9.0300
  • 100 $8.6600
  • 500 $8.2900
  • 1,000 $7.8300
$7.8300 / $9.2100 Buy Now

Part Details for MCF51MM256CML

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MCF51MM256CML Part Data Attributes:

MCF51MM256CML Freescale Semiconductor
Buy Now Datasheet
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MCF51MM256CML Freescale Semiconductor MCF51MM 32-bit MCU, ColdFire V1 core, 256KB Flash, 50MHz, MAPBGA 104
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC
Part Package Code BGA
Package Description 10 X 10 MM, ROHS COMPLIANT, MAPBGA-104
Pin Count 104
Reach Compliance Code compliant
ECCN Code 3A991
HTS Code 8542.31.00.01
Has ADC YES
Address Bus Width
Bit Size 32
CPU Family COLDFIRE
Clock Frequency-Max 16 MHz
DAC Channels YES
DMA Channels NO
External Data Bus Width
JESD-30 Code S-PBGA-B104
Length 10 mm
Moisture Sensitivity Level 3
Number of I/O Lines 72
Number of Terminals 104
On Chip Program ROM Width 8
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
PWM Channels YES
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Equivalence Code BGA104,11X11,32
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
RAM (bytes) 32768
ROM (words) 262144
ROM Programmability FLASH
Seated Height-Max 1.52 mm
Speed 50.33 MHz
Supply Current-Max 48 mA
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
Supply Voltage-Nom 3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN SILVER COPPER OVER NICKEL
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 10 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER

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