Part Details for MCF5251CVM140R2 by NXP Semiconductors
Overview of MCF5251CVM140R2 by NXP Semiconductors
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for MCF5251CVM140R2
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
11AC3338
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Newark | Amadeus+Usb/ Reel Rohs Compliant: Yes |Nxp MCF5251CVM140R2 RoHS: Compliant Min Qty: 1000 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$21.3900 | Buy Now |
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DISTI #
MCF5251CVM140R2-ND
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DigiKey | IC MCU 32BIT ROMLESS 225MAPBGA Min Qty: 1000 Lead time: 13 Weeks Container: Tape & Reel (TR) | Limited Supply - Call |
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$19.6534 | Buy Now |
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DISTI #
MCF5251CVM140R2
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Avnet Americas | MCF5251CVM140/LFBGA225/REEL 13 - Tape and Reel (Alt: MCF5251CVM140R2) Min Qty: 1000 Package Multiple: 1000 Lead time: 13 Weeks, 0 Days Container: Reel | 0 |
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$17.2950 | Buy Now |
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DISTI #
841-MCF5251CVM140R2
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Mouser Electronics | Microprocessors - MPU AMADEUS+USB | 0 |
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Order Now | |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 1000 Package Multiple: 1000 Lead time: 13 Weeks Container: Reel | 0Reel |
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$19.6600 | Buy Now |
Part Details for MCF5251CVM140R2
MCF5251CVM140R2 CAD Models
MCF5251CVM140R2 Part Data Attributes
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MCF5251CVM140R2
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
MCF5251CVM140R2
NXP Semiconductors
32-BIT, 140MHz, MICROPROCESSOR, PBGA225
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| Rohs Code | Yes | |
| Part Life Cycle Code | Not Recommended | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | LEAD FREE, MAPBGA-225 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 13 Weeks | |
| Address Bus Width | 24 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 140 MHz | |
| External Data Bus Width | 32 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B225 | |
| JESD-609 Code | e1 | |
| Length | 13 mm | |
| Low Power Mode | NO | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 225 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 1.6 mm | |
| Speed | 140 MHz | |
| Supply Voltage-Max | 1.32 V | |
| Supply Voltage-Min | 1.08 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 13 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR |