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Overview of MCF5272CVM66 by Rochester Electronics LLC
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- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for MCF5272CVM66 by Rochester Electronics LLC
Part Data Attributes for MCF5272CVM66 by Rochester Electronics LLC
|
|
---|---|
Pbfree Code
|
Yes
|
Part Life Cycle Code
|
Active
|
Ihs Manufacturer
|
ROCHESTER ELECTRONICS LLC
|
Part Package Code
|
BGA
|
Package Description
|
PLASTIC, BGA-196
|
Pin Count
|
196
|
Reach Compliance Code
|
unknown
|
Address Bus Width
|
23
|
Bit Size
|
32
|
Boundary Scan
|
YES
|
Clock Frequency-Max
|
66 MHz
|
External Data Bus Width
|
32
|
Format
|
FIXED POINT
|
Integrated Cache
|
YES
|
JESD-30 Code
|
S-PBGA-B196
|
JESD-609 Code
|
e1
|
Length
|
15 mm
|
Low Power Mode
|
YES
|
Moisture Sensitivity Level
|
3
|
Number of Terminals
|
196
|
Operating Temperature-Max
|
85 °C
|
Operating Temperature-Min
|
-40 °C
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
BGA
|
Package Shape
|
SQUARE
|
Package Style
|
GRID ARRAY
|
Peak Reflow Temperature (Cel)
|
260
|
Qualification Status
|
COMMERCIAL
|
Seated Height-Max
|
1.75 mm
|
Speed
|
66 MHz
|
Supply Voltage-Max
|
3.6 V
|
Supply Voltage-Min
|
3 V
|
Supply Voltage-Nom
|
3.3 V
|
Surface Mount
|
YES
|
Temperature Grade
|
INDUSTRIAL
|
Terminal Finish
|
TIN SILVER COPPER
|
Terminal Form
|
BALL
|
Terminal Pitch
|
1 mm
|
Terminal Position
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s)
|
40
|
Width
|
15 mm
|
uPs/uCs/Peripheral ICs Type
|
MICROPROCESSOR, RISC
|
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