There are no models available for this part yet.
Overview of MCIMX6D7CVT08AC by Freescale Semiconductor
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 3 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Industrial Automation
Renewable Energy
Robotics and Drones
Price & Stock for MCIMX6D7CVT08AC by Freescale Semiconductor
| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
| Bristol Electronics | 46 |
|
RFQ | ||||
| Quest Components | RISC MICROPROCESSOR, 64-BIT, 800MHZ, CMOS, PBGA624 | 36 |
|
$65.2440 / $81.5550 | Buy Now | ||
| Quest Components | RISC MICROPROCESSOR, 64-BIT, 800MHZ, CMOS, PBGA624 | 10 |
|
$50.9719 / $53.0108 | Buy Now |
CAD Models for MCIMX6D7CVT08AC by Freescale Semiconductor
Part Data Attributes for MCIMX6D7CVT08AC by Freescale Semiconductor
|
|
|
|---|---|
|
Pbfree Code
|
Yes
|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Transferred
|
|
Ihs Manufacturer
|
FREESCALE SEMICONDUCTOR INC
|
|
Package Description
|
FCBGA-624
|
|
Reach Compliance Code
|
compliant
|
|
ECCN Code
|
5A992
|
|
HTS Code
|
8542.31.00.01
|
|
JESD-30 Code
|
S-PBGA-B624
|
|
JESD-609 Code
|
e1
|
|
Length
|
21 mm
|
|
Moisture Sensitivity Level
|
3
|
|
Number of Terminals
|
624
|
|
Operating Temperature-Max
|
105 °C
|
|
Operating Temperature-Min
|
-40 °C
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
FBGA
|
|
Package Equivalence Code
|
BGA624,25X25,32
|
|
Package Shape
|
SQUARE
|
|
Package Style
|
GRID ARRAY, FINE PITCH
|
|
Peak Reflow Temperature (Cel)
|
260
|
|
Qualification Status
|
Not Qualified
|
|
Seated Height-Max
|
2.16 mm
|
|
Supply Voltage-Max
|
1.5 V
|
|
Supply Voltage-Min
|
1.275 V
|
|
Supply Voltage-Nom
|
1.4 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Terminal Finish
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
|
Terminal Form
|
BALL
|
|
Terminal Pitch
|
0.8 mm
|
|
Terminal Position
|
BOTTOM
|
|
Time@Peak Reflow Temperature-Max (s)
|
40
|
|
Width
|
21 mm
|
|
uPs/uCs/Peripheral ICs Type
|
SoC
|
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