Part Details for MCIMX6S6AVM08AB by Freescale Semiconductor
Overview of MCIMX6S6AVM08AB by Freescale Semiconductor
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Applications
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Part Details for MCIMX6S6AVM08AB
MCIMX6S6AVM08AB CAD Models
MCIMX6S6AVM08AB Part Data Attributes
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MCIMX6S6AVM08AB
Freescale Semiconductor
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Datasheet
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MCIMX6S6AVM08AB
Freescale Semiconductor
i.MX 6 series 32-bit MPU, ARM Cortex-A9 core, 800MHz, MAPBGA 624
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
Package Description | 21 X 21 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-2240 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A992 | |
HTS Code | 8542.31.00.01 | |
Samacsys Manufacturer | NXP | |
Address Bus Width | 16 | |
Bit Size | 64 | |
Boundary Scan | YES | |
Clock Frequency-Max | 24 MHz | |
External Data Bus Width | 32 | |
Format | FIXED POINT | |
Integrated Cache | YES | |
JESD-30 Code | S-PBGA-B2240 | |
JESD-609 Code | e1 | |
Length | 21 mm | |
Low Power Mode | YES | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 2240 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Equivalence Code | BGA624,25X25,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.5 mm | |
Speed | 800 MHz | |
Supply Current-Max | 2200 mA | |
Supply Voltage-Max | 1.5 V | |
Supply Voltage-Min | 1.275 V | |
Supply Voltage-Nom | 1.35 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | AUTOMOTIVE | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 21 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |