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Overview of MCM6264DP25 by Motorola Semiconductor Products
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- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
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CAD Models for MCM6264DP25 by Motorola Semiconductor Products
Part Data Attributes for MCM6264DP25 by Motorola Semiconductor Products
|
|
---|---|
Rohs Code
|
No
|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
MOTOROLA INC
|
Package Description
|
DIP, DIP28,.3
|
Reach Compliance Code
|
unknown
|
ECCN Code
|
EAR99
|
HTS Code
|
8542.32.00.41
|
Access Time-Max
|
25 ns
|
I/O Type
|
COMMON
|
JESD-30 Code
|
R-PDIP-T28
|
JESD-609 Code
|
e0
|
Memory Density
|
65536 bit
|
Memory IC Type
|
STANDARD SRAM
|
Memory Width
|
8
|
Number of Terminals
|
28
|
Number of Words
|
8192 words
|
Number of Words Code
|
8000
|
Operating Mode
|
ASYNCHRONOUS
|
Operating Temperature-Max
|
70 °C
|
Operating Temperature-Min
|
|
Organization
|
8KX8
|
Output Characteristics
|
3-STATE
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
DIP
|
Package Equivalence Code
|
DIP28,.3
|
Package Shape
|
RECTANGULAR
|
Package Style
|
IN-LINE
|
Parallel/Serial
|
PARALLEL
|
Qualification Status
|
Not Qualified
|
Standby Current-Max
|
0.005 A
|
Standby Voltage-Min
|
4.5 V
|
Supply Current-Max
|
0.1 mA
|
Supply Voltage-Nom (Vsup)
|
5 V
|
Surface Mount
|
NO
|
Technology
|
CMOS
|
Temperature Grade
|
COMMERCIAL
|
Terminal Finish
|
Tin/Lead (Sn/Pb)
|
Terminal Form
|
THROUGH-HOLE
|
Terminal Pitch
|
2.54 mm
|
Terminal Position
|
DUAL
|