Part Details for MCM66760C by Freescale Semiconductor
Overview of MCM66760C by Freescale Semiconductor
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- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Part Details for MCM66760C
MCM66760C CAD Models
MCM66760C Part Data Attributes
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MCM66760C
Freescale Semiconductor
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Datasheet
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MCM66760C
Freescale Semiconductor
IC,CHARACTER GENERATOR,MOS,DIP,24PIN,CERAMIC
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | MOTOROLA SEMICONDUCTOR PRODUCTS | |
Package Description | DIP, DIP24,.6 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
JESD-30 Code | R-XDIP-T24 | |
JESD-609 Code | e0 | |
Number of Terminals | 24 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Package Body Material | CERAMIC | |
Package Code | DIP | |
Package Equivalence Code | DIP24,.6 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Qualification Status | Not Qualified | |
Surface Mount | NO | |
Technology | MOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL |