There are no models available for this part yet.
Overview of MCM67A618AFN10 by NXP Semiconductors
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Computing and Data Storage
Financial Technology (Fintech)
CAD Models for MCM67A618AFN10 by NXP Semiconductors
Part Data Attributes for MCM67A618AFN10 by NXP Semiconductors
|
|
---|---|
Part Life Cycle Code
|
Obsolete
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Ihs Manufacturer
|
NXP SEMICONDUCTORS
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Package Description
|
LCC-52
|
Reach Compliance Code
|
unknown
|
ECCN Code
|
3A991.B.2.A
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HTS Code
|
8542.32.00.41
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Access Time-Max
|
10 ns
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JESD-30 Code
|
S-PQCC-J52
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Length
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19.125 mm
|
Memory Density
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1179648 bit
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Memory IC Type
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CACHE SRAM
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Memory Width
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18
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Number of Functions
|
1
|
Number of Terminals
|
52
|
Number of Words
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65536 words
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Number of Words Code
|
64000
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Operating Mode
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ASYNCHRONOUS
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Operating Temperature-Max
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70 °C
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Operating Temperature-Min
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|
Organization
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64KX18
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Package Body Material
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PLASTIC/EPOXY
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Package Code
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QCCJ
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Package Shape
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SQUARE
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Package Style
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CHIP CARRIER
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Parallel/Serial
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PARALLEL
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Seated Height-Max
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4.57 mm
|
Supply Voltage-Max (Vsup)
|
5.25 V
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Supply Voltage-Min (Vsup)
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4.75 V
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Supply Voltage-Nom (Vsup)
|
5 V
|
Surface Mount
|
YES
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Technology
|
BICMOS
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Temperature Grade
|
COMMERCIAL
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Terminal Form
|
J BEND
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Terminal Pitch
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1.27 mm
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Terminal Position
|
QUAD
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Width
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19.125 mm
|