Part Details for MD7IC2250NBR1 by NXP Semiconductors
Overview of MD7IC2250NBR1 by NXP Semiconductors
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Applications
Telecommunications
Part Details for MD7IC2250NBR1
MD7IC2250NBR1 CAD Models
MD7IC2250NBR1 Part Data Attributes
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MD7IC2250NBR1
NXP Semiconductors
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MD7IC2250NBR1
NXP Semiconductors
TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, PDFM14
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | ROHS COMPLIANT, PLASTIC, TO-272, 14 PIN | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.33.00.01 | |
| Factory Lead Time | 4 Weeks | |
| Samacsys Manufacturer | NXP | |
| JESD-30 Code | R-PDFM-T14 | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 14 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | RECTANGULAR | |
| Package Style | FLANGE MOUNT | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Nom | 28 V | |
| Surface Mount | NO | |
| Telecom IC Type | RF AND BASEBAND CIRCUIT | |
| Terminal Finish | TIN | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 40 |