Part Details for MF1SEP1001DUD/03V by NXP Semiconductors
Overview of MF1SEP1001DUD/03V by NXP Semiconductors
- Distributor Offerings:
- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
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Price & Stock for MF1SEP1001DUD/03V
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
95AC1571
|
Newark | Secure Contactless Smart Card Ic For Seamless Migration/Ffc Rohs Compliant: Yes |Nxp MF1SEP1001DUD/03V Min Qty: 473400 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
$0.5380 | Buy Now |
DISTI #
MF1SEP1001DUD/03V-ND
|
DigiKey | IC RFID TRANSP 13.56MHZ DIE Min Qty: 473400 Lead time: 16 Weeks Container: Bulk | Temporarily Out of Stock |
|
$0.5009 | Buy Now |
DISTI #
MF1SEP1001DUD/03V
|
Avnet Americas | Secure Contactless Smart Card IC Wafer - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: MF1SEP1001DUD/03V) RoHS: Not Compliant Min Qty: 473400 Package Multiple: 473400 Lead time: 16 Weeks, 0 Days Container: Waffle Pack | 0 |
|
$0.5166 / $0.5704 | Buy Now |
|
Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 473400 Package Multiple: 473400 | 0 |
|
$0.5050 | Buy Now |
DISTI #
MF1SEP1001DUD/03V
|
Avnet Americas | Secure Contactless Smart Card IC Wafer - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: MF1SEP1001DUD/03V) RoHS: Not Compliant Min Qty: 473400 Package Multiple: 473400 Lead time: 16 Weeks, 0 Days Container: Waffle Pack | 0 |
|
$0.5166 / $0.5704 | Buy Now |
DISTI #
MF1SEP1001DUD/03V
|
Avnet Americas | Secure Contactless Smart Card IC Wafer - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: MF1SEP1001DUD/03V) RoHS: Not Compliant Min Qty: 473400 Package Multiple: 473400 Lead time: 16 Weeks, 0 Days Container: Waffle Pack | 0 |
|
$0.5166 / $0.5704 | Buy Now |