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RISC Microprocessor
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Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
72AC8339
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Newark | I.mxrt1064/Tray, Bakeable, Multiple In Drypack Rohs Compliant: Yes |Nxp MIMXRT1064CVL5A Min Qty: 240 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
$10.0400 / $11.8800 | Buy Now |
DISTI #
568-14708-ND
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DigiKey | IC MCU 32BIT 4MB FLASH 196MAPBGA Lead time: 15 Weeks Container: Tray | Limited Supply - Call |
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Buy Now | |
DISTI #
MIMXRT1064CVL5A
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Avnet Americas | MCU 32-Bit RT1064 ARM Cortex-M7 RISC 4MB Flash 3V to 3.6V 196-Pin MAPBGA Tray - Trays (Alt: MIMXRT1064CVL5A) RoHS: Compliant Min Qty: 480 Package Multiple: 240 Lead time: 15 Weeks, 0 Days Container: Tray | 0 |
|
RFQ | |
DISTI #
MIMXRT1064CVL5A
|
Avnet Americas | MCU 32-Bit RT1064 ARM Cortex-M7 RISC 4MB Flash 3V to 3.6V 196-Pin MAPBGA Tray - Trays (Alt: MIMXRT1064CVL5A) RoHS: Compliant Min Qty: 480 Package Multiple: 240 Lead time: 15 Weeks, 0 Days Container: Tray | 0 |
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RFQ | |
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Ameya Holding Limited | Processors - Application Specialised i.MXRT1064 / 12NC: 935377468557 | 25495 |
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RFQ | |
DISTI #
MIMXRT1064CVL5A
|
Avnet Americas | MCU 32-Bit RT1064 ARM Cortex-M7 RISC 4MB Flash 3V to 3.6V 196-Pin MAPBGA Tray - Trays (Alt: MIMXRT1064CVL5A) RoHS: Compliant Min Qty: 480 Package Multiple: 240 Lead time: 15 Weeks, 0 Days Container: Tray | 0 |
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RFQ | |
DISTI #
2946822
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Farnell | MPU, 32BIT, 500MHZ, -40 TO 105DEG C RoHS: Compliant Min Qty: 1 Lead time: 16 Weeks, 0 Days Container: Each | 0 |
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$13.1196 | Buy Now |
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MIMXRT1064CVL5A
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
MIMXRT1064CVL5A
NXP Semiconductors
RISC Microprocessor
|
Rohs Code | Yes | |
Part Life Cycle Code | Not Recommended | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | MABGA-196 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A992.C | |
HTS Code | 8542.31.00.01 | |
Factory Lead Time | 15 Weeks | |
Date Of Intro | 2019-05-21 | |
Samacsys Manufacturer | NXP | |
JESD-30 Code | S-PBGA-B196 | |
Length | 10 mm | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 196 | |
Operating Temperature-Max | 105 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Equivalence Code | BGA196,14X14,25 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Seated Height-Max | 1.43 mm | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.15 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | BALL | |
Terminal Pitch | 0.65 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 10 mm | |
uPs/uCs/Peripheral ICs Type | SoC |