Part Details for MK30DX256ZVMD10 by Freescale Semiconductor
Overview of MK30DX256ZVMD10 by Freescale Semiconductor
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Part Details for MK30DX256ZVMD10
MK30DX256ZVMD10 CAD Models
MK30DX256ZVMD10 Part Data Attributes
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MK30DX256ZVMD10
Freescale Semiconductor
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MK30DX256ZVMD10
Freescale Semiconductor
32-BIT, FLASH, 100MHz, RISC MICROCONTROLLER, PBGA144, 13 X 13 MM, MAPBGA-144
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
Part Package Code | BGA | |
Package Description | 13 X 13 MM, MAPBGA-144 | |
Pin Count | 144 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Samacsys Manufacturer | NXP | |
Has ADC | YES | |
Address Bus Width | ||
Bit Size | 32 | |
CPU Family | CORTEX-M4 | |
Clock Frequency-Max | 50 MHz | |
DAC Channels | YES | |
DMA Channels | YES | |
External Data Bus Width | ||
JESD-30 Code | S-PBGA-B144 | |
Length | 13 mm | |
Moisture Sensitivity Level | 3 | |
Number of I/O Lines | 100 | |
Number of Terminals | 144 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 105 °C | |
Operating Temperature-Min | -40 °C | |
PWM Channels | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA144,12X12,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
RAM (bytes) | 65536 | |
ROM (words) | 262144 | |
ROM Programmability | FLASH | |
Seated Height-Max | 1.7 mm | |
Speed | 100 MHz | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 1.71 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN SILVER COPPER OVER NICKEL | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 13 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |