Datasheets
MMZ2012Y121BT000 by: TDK Corporation

Ferrite Chip, 1 Function(s), 0.8A,

Part Details for MMZ2012Y121BT000 by TDK Corporation

Results Overview of MMZ2012Y121BT000 by TDK Corporation

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Applications Environmental Monitoring Industrial Automation

MMZ2012Y121BT000 Information

MMZ2012Y121BT000 by TDK Corporation is a Data Line Filter.
Data Line Filters are under the broader part category of Filters.

A filter is an electronic circuit that selectively allows certain frequencies to pass while attenuating others. They are used to extract desired signals and remove noise. Read more about Filters on our Filters part category page.

Price & Stock for MMZ2012Y121BT000

Part # Distributor Description Stock Price Buy
DISTI # 1669728
Farnell FERRITE BEAD, 0.12OHM, 800MA, 0805 RoHS: Compliant Min Qty: 1 Lead time: 21 Weeks, 1 Days Container: Cut Tape 4
  • 1 $0.0596
$0.0596 Buy Now
DISTI # 1669728RL
Farnell FERRITE BEAD, 0.12OHM, 800MA, 0805 RoHS: Compliant Min Qty: 1 Lead time: 21 Weeks, 1 Days Container: Reel 4
  • 1 $0.0596
$0.0596 Buy Now

Part Details for MMZ2012Y121BT000

MMZ2012Y121BT000 CAD Models

MMZ2012Y121BT000 Part Data Attributes

MMZ2012Y121BT000 TDK Corporation
Buy Now Datasheet
Compare Parts:
MMZ2012Y121BT000 TDK Corporation Ferrite Chip, 1 Function(s), 0.8A,
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer TDK CORP
Package Description EIA STD PACKAGE SIZE 0805, SMD, 2 PIN
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8504.50.80.00
Samacsys Manufacturer TDK
Case Code 0805
Construction Chip Bead
DC Resistance-Max 0.12 Ω
Filter Type FERRITE CHIP
Height 0.85 mm
Length 2 mm
Mounting Type SURFACE MOUNT
Number of Functions 1
Number of Terminals 2
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Output Impedance 120 OHM Ω
Packing Method TR, 7 INCH
Rated Current 0.8 A
Width 1.25 mm

MMZ2012Y121BT000 Related Parts

MMZ2012Y121BT000 Frequently Asked Questions (FAQ)

  • The recommended land pattern for the MMZ2012Y121BT000 is a rectangular pad with a size of 1.2mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder resist opening of 0.5mm x 0.5mm.

  • During reflow soldering, the MMZ2012Y121BT000 should be placed on a flat, even surface to prevent warping or deformation. The component should be exposed to a peak temperature of 260°C for no more than 10 seconds, and the total thermal exposure should not exceed 30 seconds.

  • The MMZ2012Y121BT000 has an operating temperature range of -55°C to +125°C, but it's recommended to derate the component's power rating at high temperatures to ensure reliable operation.

  • Yes, the MMZ2012Y121BT000 is designed to withstand high-vibration environments, but it's recommended to secure the component to the PCB using a suitable adhesive or mechanical fastening method to prevent movement or detachment during operation.

  • The MMZ2012Y121BT000 should be stored in a dry, cool place, away from direct sunlight and moisture. It's recommended to store the components in their original packaging or in a sealed bag with a desiccant packet to maintain a low humidity environment.

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