There are no models available for this part yet.
Overview of MPC8266AZUPJDC by NXP Semiconductors
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 1 listing )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Industrial Automation
Renewable Energy
Robotics and Drones
Price & Stock for MPC8266AZUPJDC by NXP Semiconductors
| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
|
DISTI #
MPC8266AZUPJDC
|
EBV Elektronik | MPU MPC82xx RISC 32-Bit 0.25um 300MHz 3.3V 480-Pin TBGA Tray (Alt: MPC8266AZUPJDC) RoHS: Not Compliant Min Qty: 21 Package Multiple: 21 Lead time: 27 Weeks, 0 Days | EBV - 0 |
|
Buy Now |
CAD Models for MPC8266AZUPJDC by NXP Semiconductors
Part Data Attributes for MPC8266AZUPJDC by NXP Semiconductors
|
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|
|---|---|
|
Rohs Code
|
No
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|
Part Life Cycle Code
|
Obsolete
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Ihs Manufacturer
|
NXP SEMICONDUCTORS
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|
Package Description
|
37.50 X 37.50 MM, 1.55 MM HEIGHT, 1.27 MM PITCH, TBGA-480
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|
Reach Compliance Code
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unknown
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|
HTS Code
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8542.31.00.01
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|
Address Bus Width
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32
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Bit Size
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32
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Boundary Scan
|
YES
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External Data Bus Width
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64
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Format
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FLOATING POINT
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Integrated Cache
|
YES
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JESD-30 Code
|
S-PBGA-B480
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JESD-609 Code
|
e0
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Length
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37.5 mm
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Low Power Mode
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NO
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Moisture Sensitivity Level
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3
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Number of Terminals
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480
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Package Body Material
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PLASTIC/EPOXY
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Package Code
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LBGA
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Package Shape
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SQUARE
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Package Style
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GRID ARRAY, LOW PROFILE
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Seated Height-Max
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1.65 mm
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Surface Mount
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YES
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Technology
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CMOS
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Terminal Finish
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TIN LEAD
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Terminal Form
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BALL
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Terminal Pitch
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1.27 mm
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Terminal Position
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BOTTOM
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Width
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37.5 mm
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uPs/uCs/Peripheral ICs Type
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MICROPROCESSOR, RISC
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