Part Details for MPC8533VTARJA by NXP Semiconductors
Overview of MPC8533VTARJA by NXP Semiconductors
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for MPC8533VTARJA
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
MPC8533VTARJA
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Avnet Americas | - Trays (Alt: MPC8533VTARJA) RoHS: Compliant Min Qty: 3 Package Multiple: 1 Lead time: 4 Weeks, 0 Days Container: Tray | 1472 Partner Stock |
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RFQ | |
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Rochester Electronics | PowerQUICC RISC Microprocessor, CMOS RoHS: Compliant Status: Obsolete Min Qty: 1 | 108 |
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$110.1800 / $129.6200 | Buy Now |
Part Details for MPC8533VTARJA
MPC8533VTARJA CAD Models
MPC8533VTARJA Part Data Attributes
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MPC8533VTARJA
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
MPC8533VTARJA
NXP Semiconductors
RISC PROCESSOR
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | FCBGA-783 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 4 Weeks | |
| Address Bus Width | 16 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| External Data Bus Width | 64 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B783 | |
| JESD-609 Code | e2 | |
| Length | 29 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 783 | |
| Operating Temperature-Max | 90 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 2.8 mm | |
| Speed | 1067 MHz | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 0.95 V | |
| Supply Voltage-Nom | 1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | Tin/Silver (Sn/Ag) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 29 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |