Part Details for MPC8536EBVJANGA by NXP Semiconductors
Overview of MPC8536EBVJANGA by NXP Semiconductors
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Price & Stock for MPC8536EBVJANGA
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
4376200
|
Farnell | MICROPROCESSORS IC'S RoHS: Compliant Min Qty: 36 Lead time: 3 Weeks, 1 Days Container: Each | 28 |
|
$285.7446 | Buy Now |
|
Flip Electronics | Stock | 360 |
|
RFQ |
Part Details for MPC8536EBVJANGA
MPC8536EBVJANGA CAD Models
MPC8536EBVJANGA Part Data Attributes:
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MPC8536EBVJANGA
NXP Semiconductors
Buy Now
|
Compare Parts:
MPC8536EBVJANGA
NXP Semiconductors
RISC PROCESSOR
|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | 29 X 29 MM, 2.80 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, FCBGA-783 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.1 | |
HTS Code | 8542.31.00.01 | |
Factory Lead Time | 4 Weeks | |
Address Bus Width | 16 | |
Bit Size | 32 | |
Boundary Scan | YES | |
Clock Frequency-Max | 133 MHz | |
External Data Bus Width | 64 | |
Format | FLOATING POINT | |
Integrated Cache | YES | |
JESD-30 Code | S-PBGA-B783 | |
JESD-609 Code | e2 | |
Length | 29 mm | |
Low Power Mode | YES | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 783 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HBGA | |
Package Equivalence Code | BGA783,28X28,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, HEAT SINK/SLUG | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 2.76 mm | |
Speed | 800 MHz | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 0.95 V | |
Supply Voltage-Nom | 1 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Finish | Tin/Silver (Sn/Ag) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 29 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |