Part Details for MPC853TZT100A by NXP Semiconductors
Overview of MPC853TZT100A by NXP Semiconductors
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Industrial Automation
Agriculture Technology
Electronic Manufacturing
Robotics and Drones
Price & Stock for MPC853TZT100A
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
MPC853TZT100A
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Avnet Americas | MPU MPC8xx RISC 32-Bit 0.18um 100MHz 3.3V 256-Pin BGA Tray - Trays (Alt: MPC853TZT100A) RoHS: Not Compliant Min Qty: 60 Package Multiple: 60 Container: Tray | 0 |
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RFQ | |
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DISTI #
MPC853TZT100A
|
Avnet Americas | MPU MPC8xx RISC 32-Bit 0.18um 100MHz 3.3V 256-Pin BGA Tray - Trays (Alt: MPC853TZT100A) RoHS: Not Compliant Min Qty: 60 Package Multiple: 60 Container: Tray | 0 |
|
RFQ | |
|
DISTI #
4376210
|
Farnell | MICROPROCESSORS IC'S RoHS: Not Compliant Min Qty: 1 Lead time: 3 Weeks, 1 Days Container: Each | 2637 |
|
$41.9439 | Buy Now |
|
|
Flip Electronics | Stock | 1080 |
|
RFQ |
Part Details for MPC853TZT100A
MPC853TZT100A CAD Models
MPC853TZT100A Part Data Attributes:
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MPC853TZT100A
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
MPC853TZT100A
NXP Semiconductors
RISC PROCESSOR
|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | PLASTIC, BGA-256 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| External Data Bus Width | 32 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B256 | |
| JESD-609 Code | e0 | |
| Length | 23 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Peak Reflow Temperature (Cel) | 220 | |
| Seated Height-Max | 2.54 mm | |
| Speed | 100 MHz | |
| Supply Voltage-Max | 1.9 V | |
| Supply Voltage-Min | 1.7 V | |
| Supply Voltage-Nom | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 23 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |