Datasheets
MPC860DPCZQ50D4 by:

32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357

Part Details for MPC860DPCZQ50D4 by Freescale Semiconductor

Overview of MPC860DPCZQ50D4 by Freescale Semiconductor

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Applications Computing and Data Storage

Price & Stock for MPC860DPCZQ50D4

Part # Distributor Description Stock Price Buy
DISTI # 2156-MPC860DPCZQ50D4-ND
DigiKey IC MPU MPC86XX 50MHZ 357BGA Min Qty: 2 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT 55
In Stock
  • 2 $157.7500
$157.7500 Buy Now
Rochester Electronics MPC860DP - PowerQUICC, 32 Bit Power Architecture SoC, 50MHz, -40 to 95C RoHS: Not Compliant Status: Rochester-Active Min Qty: 1 55
  • 1 $159.2600
  • 25 $156.0800
  • 100 $149.7100
  • 500 $143.3400
  • 1,000 $135.3700
$135.3700 / $159.2600 Buy Now

Part Details for MPC860DPCZQ50D4

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MPC860DPCZQ50D4 Part Data Attributes:

MPC860DPCZQ50D4 Freescale Semiconductor
Buy Now Datasheet
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MPC860DPCZQ50D4 Freescale Semiconductor 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357
Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC
Part Package Code BGA
Package Description 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357
Pin Count 357
Reach Compliance Code not_compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Address Bus Width 32
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 50 MHz
External Data Bus Width 32
Format FIXED POINT
Integrated Cache YES
JESD-30 Code S-PBGA-B357
JESD-609 Code e0
Length 25 mm
Low Power Mode YES
Moisture Sensitivity Level 3
Number of Terminals 357
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA357,19X19,50
Package Shape SQUARE
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 245
Qualification Status Not Qualified
Seated Height-Max 2.52 mm
Speed 50 MHz
Supply Voltage-Max 3.465 V
Supply Voltage-Min 3.135 V
Supply Voltage-Nom 3.3 V
Surface Mount YES
Technology CMOS
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

Alternate Parts for MPC860DPCZQ50D4

This table gives cross-reference parts and alternative options found for MPC860DPCZQ50D4. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MPC860DPCZQ50D4, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
TSXPC860MHVZPU50C1 RISC Microprocessor, 32-Bit, 50MHz, PBGA357 Microchip Technology Inc MPC860DPCZQ50D4 vs TSXPC860MHVZPU50C1
MPC855TVR50D4 PowerQUICC, 32 Bit Power Architecture SoC, 50MHz, CPM, ENET, ATM, HDLC, PCMCIA, 0 to 95C Freescale Semiconductor MPC860DPCZQ50D4 vs MPC855TVR50D4
XPC860PZP50D3 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 Motorola Mobility LLC MPC860DPCZQ50D4 vs XPC860PZP50D3
TSPC860SRMZP50D RISC Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357 e2v technologies MPC860DPCZQ50D4 vs TSPC860SRMZP50D
XPC860DTZP50D3 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 Motorola Mobility LLC MPC860DPCZQ50D4 vs XPC860DTZP50D3
TSXPC860SRMZPU50C1 RISC Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357 Atmel Corporation MPC860DPCZQ50D4 vs TSXPC860SRMZPU50C1
MPC860TCZQ50D4 32-BIT, 50MHz, RISC PROCESSOR, PBGA357 NXP Semiconductors MPC860DPCZQ50D4 vs MPC860TCZQ50D4
MPC860PCZQ50D4 32-BIT, 50MHz, RISC PROCESSOR, PBGA357 NXP Semiconductors MPC860DPCZQ50D4 vs MPC860PCZQ50D4
XPC860DPZP50D4 IC,COMMUNICATIONS CONTROLLER,BGA,357PIN Freescale Semiconductor MPC860DPCZQ50D4 vs XPC860DPZP50D4
MPC855TVR50D4 32-BIT, 50MHz, RISC PROCESSOR, PBGA357 NXP Semiconductors MPC860DPCZQ50D4 vs MPC855TVR50D4
Part Number Description Manufacturer Compare
MPC860SRZQ80D4 PowerQUICC, 32 Bit Power Architecture, 80MHz, Communications Processor, 0 to 95C Freescale Semiconductor MPC860DPCZQ50D4 vs MPC860SRZQ80D4
MPC855TVR50D4 PowerQUICC, 32 Bit Power Architecture SoC, 50MHz, CPM, ENET, ATM, HDLC, PCMCIA, 0 to 95C Freescale Semiconductor MPC860DPCZQ50D4 vs MPC855TVR50D4
TS(X)PC860MHMGU50B Microprocessor, 32-Bit, 50MHz, CMOS, CBGA357, CERAMIC, BGA-357 Thales Group MPC860DPCZQ50D4 vs TS(X)PC860MHMGU50B
MPC860PCVR66D4 PowerQUICC, 32 Bit Power Architecture SoC, 66MHz, CPM, ENET, ATM, HDLC, PCMCIA, -40 to 95C Freescale Semiconductor MPC860DPCZQ50D4 vs MPC860PCVR66D4
XPC857TZP66B 32-BIT, 66MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 Motorola Mobility LLC MPC860DPCZQ50D4 vs XPC857TZP66B
TS(X)PC860MHMZPU/T40C 32-BIT, 40MHz, MICROPROCESSOR, PBGA357, PLASTIC, BGA-357 e2v technologies MPC860DPCZQ50D4 vs TS(X)PC860MHMZPU/T40C
TSXPC860MHVZPU50D4 RISC Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357 Atmel Corporation MPC860DPCZQ50D4 vs TSXPC860MHVZPU50D4
TSPC860MHMZPB/Q40A3 Microprocessor, 32-Bit, 40MHz, CMOS, PBGA357, PLASTIC, BGA-357 Thales Group MPC860DPCZQ50D4 vs TSPC860MHMZPB/Q40A3
TS(X)PC860MHVZP40A3 Microprocessor, 32-Bit, 40MHz, CMOS, PBGA357, PLASTIC, BGA-357 Thales Group MPC860DPCZQ50D4 vs TS(X)PC860MHVZP40A3
XPC855TCZP50D4R2 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 Motorola Mobility LLC MPC860DPCZQ50D4 vs XPC855TCZP50D4R2

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