Part Details for MPC860TZQ66D4 by Freescale Semiconductor
Overview of MPC860TZQ66D4 by Freescale Semiconductor
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Price & Stock for MPC860TZQ66D4
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2156-MPC860TZQ66D4-600055-ND
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DigiKey | POWERQUICC 32 BIT POWER ARCHITEC Min Qty: 2 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT |
24 In Stock |
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$177.6200 | Buy Now |
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Rochester Electronics | MPC860T - PowerQUICC, 32 Bit Power Architecture, 66MHz, Communications Processor, 0 to 95C RoHS: Not Compliant Status: Rochester-Active Min Qty: 1 | 24 |
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$152.4300 / $179.3300 | Buy Now |
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ComSIT USA | POWER QUAD INTEGRATED COMMUNICATION CONTROLLER RISC Microprocessor, 32-Bit, 66MHz, CMOS, PBGA357 RoHS: Not Compliant | Europe - 39 |
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RFQ | |
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Chip1Cloud | IC MPU MPC8XX 66MHZ 357BGA | 1200 |
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RFQ |
Part Details for MPC860TZQ66D4
MPC860TZQ66D4 CAD Models
MPC860TZQ66D4 Part Data Attributes:
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MPC860TZQ66D4
Freescale Semiconductor
Buy Now
Datasheet
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Compare Parts:
MPC860TZQ66D4
Freescale Semiconductor
32-BIT, 66MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
| Part Package Code | BGA | |
| Package Description | 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 | |
| Pin Count | 357 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | NXP | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 50 MHz | |
| External Data Bus Width | 32 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B357 | |
| JESD-609 Code | e0 | |
| Length | 25 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 357 | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA357,19X19,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 245 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.52 mm | |
| Speed | 66 MHz | |
| Supply Voltage-Max | 3.465 V | |
| Supply Voltage-Min | 3.135 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 25 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for MPC860TZQ66D4
This table gives cross-reference parts and alternative options found for MPC860TZQ66D4. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MPC860TZQ66D4, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MPC860DEVR66D4 | PowerQUICC, 32 Bit Power Architecture SoC, 66MHz, CPM, ENET, HDLC, PCMCIA, 0 to 95C | Freescale Semiconductor | MPC860TZQ66D4 vs MPC860DEVR66D4 |
| MPC860ENCZQ66D4 | PowerQUICC, 32 Bit Power Architecture SoC, 66MHz, CPM, ENET, PCMCIA, -40 to 95C | Freescale Semiconductor | MPC860TZQ66D4 vs MPC860ENCZQ66D4 |
| MPC860TVR66D4 | PowerQUICC, 32 Bit Power Architecture, 6MHz, Communications Processor, 0 to 95C | Freescale Semiconductor | MPC860TZQ66D4 vs MPC860TVR66D4 |
| MPC860DEZQ66D4 | PowerQUICC, 32 Bit Power Architecture SoC, 66MHz, CPM, ENET, HDLC, PCMCIA, 0 to 95C | Freescale Semiconductor | MPC860TZQ66D4 vs MPC860DEZQ66D4 |
| MPC855TCVR66D4 | PowerQUICC, 32 Bit Power Architecture SoC, 66MHz, CPM, ENET, ATM, HDLC, PCMCIA, -40 to 95C | Freescale Semiconductor | MPC860TZQ66D4 vs MPC855TCVR66D4 |
| MPC860PZQ66D4R2 | 32-BIT, 66MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 | Freescale Semiconductor | MPC860TZQ66D4 vs MPC860PZQ66D4R2 |
| MPC860SRCVR66D4 | 32-BIT, 66MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, LEAD FREE, PLASTIC, BGA-357 | Freescale Semiconductor | MPC860TZQ66D4 vs MPC860SRCVR66D4 |
| MPC860DTZQ66D4 | 32-BIT, 66MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 | Freescale Semiconductor | MPC860TZQ66D4 vs MPC860DTZQ66D4 |
| MPC860PCVR66D4 | PowerQUICC, 32 Bit Power Architecture SoC, 66MHz, CPM, ENET, ATM, HDLC, PCMCIA, -40 to 95C | Freescale Semiconductor | MPC860TZQ66D4 vs MPC860PCVR66D4 |
| MPC860DPVR66D4 | 32-BIT, 66MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, LEAD FREE, PLASTIC, BGA-357 | Freescale Semiconductor | MPC860TZQ66D4 vs MPC860DPVR66D4 |