There are no models available for this part yet.
Overview of MR3A16ACMA35 by Everspin Technologies
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 4 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Education and Research
Internet of Things (IoT)
Computing and Data Storage
Aerospace and Defense
Healthcare
Telecommunications
Automotive
Price & Stock for MR3A16ACMA35 by Everspin Technologies
| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
|
DISTI #
819-MR3A16ACMA35-ND
|
DigiKey | IC RAM 8MBIT PARALLEL 48FBGA Min Qty: 1 Lead time: 20 Weeks Container: Tray |
61 In Stock |
|
$28.6521 / $38.5600 | Buy Now | |
|
DISTI #
936-MR3A16ACMA35
|
Mouser Electronics | MRAM RoHS: Compliant | 0 |
|
$28.6500 | Order Now | |
| Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 480 Package Multiple: 240 Lead time: 20 Weeks Container: Tray | 0Tray |
|
$27.1500 | Buy Now | ||
|
DISTI #
MR3A16ACMA35
|
EBV Elektronik | (Alt: MR3A16ACMA35) RoHS: Compliant Min Qty: 240 Package Multiple: 240 Lead time: 27 Weeks, 0 Days | EBV - 0 |
|
Buy Now |
CAD Models for MR3A16ACMA35 by Everspin Technologies
Part Data Attributes for MR3A16ACMA35 by Everspin Technologies
|
|
|
|---|---|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Active
|
|
Ihs Manufacturer
|
EVERSPIN TECHNOLOGIES INC
|
|
Package Description
|
FBGA-48
|
|
Reach Compliance Code
|
compliant
|
|
ECCN Code
|
EAR99
|
|
HTS Code
|
8542.32.00.71
|
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Date Of Intro
|
2019-10-31
|
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JESD-30 Code
|
S-PBGA-B48
|
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Length
|
10 mm
|
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Memory Density
|
8388608 bit
|
|
Memory IC Type
|
MEMORY CIRCUIT
|
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Memory Width
|
16
|
|
Number of Functions
|
1
|
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Number of Terminals
|
48
|
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Number of Words
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524288 words
|
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Number of Words Code
|
512000
|
|
Operating Mode
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ASYNCHRONOUS
|
|
Operating Temperature-Max
|
85 °C
|
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Operating Temperature-Min
|
-40 °C
|
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Organization
|
512KX16
|
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Package Body Material
|
PLASTIC/EPOXY
|
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Package Code
|
LFBGA
|
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Package Shape
|
SQUARE
|
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Package Style
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
|
Peak Reflow Temperature (Cel)
|
NOT SPECIFIED
|
|
Seated Height-Max
|
1.35 mm
|
|
Supply Voltage-Max (Vsup)
|
3.6 V
|
|
Supply Voltage-Min (Vsup)
|
3 V
|
|
Supply Voltage-Nom (Vsup)
|
3.3 V
|
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Surface Mount
|
YES
|
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Technology
|
CMOS
|
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Temperature Grade
|
INDUSTRIAL
|
|
Terminal Form
|
BALL
|
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Terminal Pitch
|
0.75 mm
|
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Terminal Position
|
BOTTOM
|
|
Time@Peak Reflow Temperature-Max (s)
|
NOT SPECIFIED
|
|
Width
|
10 mm
|