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Part Details for MR4A16BYS35 by Everspin Technologies
Overview of MR4A16BYS35 by Everspin Technologies
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Price & Stock for MR4A16BYS35
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
819-1054-ND
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DigiKey | IC RAM 16MBIT PARALLEL 54TSOP2 Min Qty: 1 Lead time: 20 Weeks Container: Tray |
488 In Stock |
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$31.9029 / $41.7500 | Buy Now |
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DISTI #
936-MR4A16BYS35
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Mouser Electronics | MRAM 16Mb 3.3V 35ns 1Mx16 Parallel MRAM RoHS: Compliant | 4 |
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$31.3400 / $41.3800 | Buy Now |
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Future Electronics | MRAM 16M-Bit 3.3V 54-Pin TSOP Tray RoHS: Compliant pbFree: Yes Min Qty: 216 Package Multiple: 108 Container: Tray | 0Tray |
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$30.7700 | Buy Now |
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DISTI #
MR4A16BYS35
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EBV Elektronik | FRAM / MRAM (Alt: MR4A16BYS35) RoHS: Compliant Min Qty: 108 Package Multiple: 108 Lead time: 3 Weeks, 6 Days | EBV - 0 |
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Buy Now |
Part Details for MR4A16BYS35
MR4A16BYS35 CAD Models
MR4A16BYS35 Part Data Attributes
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MR4A16BYS35
Everspin Technologies
Buy Now
Datasheet
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MR4A16BYS35
Everspin Technologies
Memory Circuit, 1MX16, CMOS, PDSO54, TSOP2-54
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | EVERSPIN TECHNOLOGIES INC | |
| Part Package Code | TSSOP2 | |
| Package Description | TSOP2, TSOP54,.46,32 | |
| Pin Count | 54 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| Samacsys Manufacturer | Everspin Technologies | |
| Access Time-Max | 35 ns | |
| Data Retention Time-Min | 20 | |
| JESD-30 Code | R-PDSO-G54 | |
| Length | 22.22 mm | |
| Memory Density | 16777216 bit | |
| Memory IC Type | MRAM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Terminals | 54 | |
| Number of Words | 1048576 words | |
| Number of Words Code | 1000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 1MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSOP2 | |
| Package Equivalence Code | TSOP54,.46,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, THIN PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.2 mm | |
| Standby Current-Max | 0.009 A | |
| Standby Voltage-Min | 3 V | |
| Supply Current-Max | 0.18 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 3 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 10.16 mm | |
| Write Cycle Time-Max (tWC) | 0.000035 ms |