Part Details for MT54V512H18EF-6 by Rochester Electronics LLC
Overview of MT54V512H18EF-6 by Rochester Electronics LLC
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Part Details for MT54V512H18EF-6
MT54V512H18EF-6 CAD Models
MT54V512H18EF-6 Part Data Attributes
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MT54V512H18EF-6
Rochester Electronics LLC
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Datasheet
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MT54V512H18EF-6
Rochester Electronics LLC
512KX18 QDR SRAM, 2.5ns, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165
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| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ROCHESTER ELECTRONICS LLC | |
| Part Package Code | BGA | |
| Package Description | 13 X 15 MM, 1 MM PITCH, FBGA-165 | |
| Pin Count | 165 | |
| Reach Compliance Code | unknown | |
| Access Time-Max | 2.5 ns | |
| Additional Feature | PIPELINED ARCHITECTURE | |
| JESD-30 Code | R-PBGA-B165 | |
| JESD-609 Code | e1 | |
| Length | 15 mm | |
| Memory Density | 9437184 bit | |
| Memory IC Type | QDR SRAM | |
| Memory Width | 18 | |
| Number of Functions | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 524288 words | |
| Number of Words Code | 512000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 512KX18 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | COMMERCIAL | |
| Seated Height-Max | 1.2 mm | |
| Supply Voltage-Max (Vsup) | 2.6 V | |
| Supply Voltage-Min (Vsup) | 2.4 V | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 13 mm |