Part Details for MT58V2MV18FF-7.5 by Micron Technology Inc
Overview of MT58V2MV18FF-7.5 by Micron Technology Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for MT58V2MV18FF-7.5
MT58V2MV18FF-7.5 CAD Models
MT58V2MV18FF-7.5 Part Data Attributes
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MT58V2MV18FF-7.5
Micron Technology Inc
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Datasheet
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MT58V2MV18FF-7.5
Micron Technology Inc
Standard SRAM, 2MX18, 7.5ns, CMOS, PBGA165, 13 X 15 MM, MO-216, FBGA-165
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MICRON TECHNOLOGY INC | |
| Part Package Code | BGA | |
| Package Description | TBGA, | |
| Pin Count | 165 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 7.5 ns | |
| Additional Feature | FLOW-THROUGH ARCHITECTURE | |
| JESD-30 Code | R-PBGA-B165 | |
| JESD-609 Code | e1 | |
| Length | 17 mm | |
| Memory Density | 37748736 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 18 | |
| Number of Functions | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 2097152 words | |
| Number of Words Code | 2000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 2MX18 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.2 mm | |
| Supply Voltage-Max (Vsup) | 2.625 V | |
| Supply Voltage-Min (Vsup) | 2.375 V | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 15 mm |
Alternate Parts for MT58V2MV18FF-7.5
This table gives cross-reference parts and alternative options found for MT58V2MV18FF-7.5. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MT58V2MV18FF-7.5, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MCM69F817ZP6 | 256KX18 CACHE SRAM, 6ns, PBGA119, 7 X 17 MM, PLASTIC, BGA-119 | Motorola Mobility LLC | MT58V2MV18FF-7.5 vs MCM69F817ZP6 |
| IBM043640QLAA-6 | Standard SRAM, 128KX36, 7.5ns, CMOS, PBGA119, BGA-119 | IBM | MT58V2MV18FF-7.5 vs IBM043640QLAA-6 |
| IS61DDP2B21M36A-400B4L | DDR SRAM, 1MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, LFBGA-165 | Integrated Silicon Solution Inc | MT58V2MV18FF-7.5 vs IS61DDP2B21M36A-400B4L |
| K7N401801A-TC160 | ZBT SRAM, 256KX18, 3.5ns, CMOS, PQFP100, 20 X 14 MM, TQFP-100 | Samsung Semiconductor | MT58V2MV18FF-7.5 vs K7N401801A-TC160 |
| K7P163612M-HC48 | Standard SRAM, 512KX36, 4.8ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, FLIP CHIP, BGA-119 | Samsung Semiconductor | MT58V2MV18FF-7.5 vs K7P163612M-HC48 |
| KM732V789H-67 | Cache SRAM, 128KX32, 3.8ns, CMOS, PBGA119, BGA-119 | Samsung Semiconductor | MT58V2MV18FF-7.5 vs KM732V789H-67 |
| IS61VPS10018-166TQ | Cache SRAM, 1MX18, 3.5ns, CMOS, PQFP100, TQFP-100 | Integrated Silicon Solution Inc | MT58V2MV18FF-7.5 vs IS61VPS10018-166TQ |
| IS61QDPB21M36A-333B4I | QDR SRAM, 1MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LFBGA-165 | Integrated Silicon Solution Inc | MT58V2MV18FF-7.5 vs IS61QDPB21M36A-333B4I |
| MCM69F817ZP6.5R | 256KX18 CACHE SRAM, 6.5ns, PBGA119, 7 X 17 MM, PLASTIC, BGA-119 | Motorola Mobility LLC | MT58V2MV18FF-7.5 vs MCM69F817ZP6.5R |
| K7I163684B-FC330 | DDR SRAM, 512KX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165 | Samsung Semiconductor | MT58V2MV18FF-7.5 vs K7I163684B-FC330 |