Part Details for NLAS4684FCTCG by onsemi
Overview of NLAS4684FCTCG by onsemi
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Consumer Electronics
Aerospace and Defense
Communication and Networking
Price & Stock for NLAS4684FCTCG
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
50M2115
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Newark | Ic, analog Switch, dual, spdt, bga,10Pin, plastic |Onsemi NLAS4684FCTCG Min Qty: 3000 Package Multiple: 1 Date Code: 0 Container: Reel | 0 |
|
Buy Now | |
DISTI #
NLAS4684FCTCG
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Avnet Americas | Analog Switch Dual SPDT 10-Pin Flip-Chip T/R - Tape and Reel (Alt: NLAS4684FCTCG) RoHS: Compliant Min Qty: 2977 Package Multiple: 1 Lead time: 0 Weeks, 2 Days Container: Reel | 3000 Partner Stock |
|
$0.2083 / $0.2486 | Buy Now |
Part Details for NLAS4684FCTCG
NLAS4684FCTCG CAD Models
NLAS4684FCTCG Part Data Attributes
|
NLAS4684FCTCG
onsemi
Buy Now
Datasheet
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NLAS4684FCTCG
onsemi
Analog Switch, Dual SPDT, 0.5 Ohm Dual SPDT .5 Ohm Analog Switch, 10 PIN FLIP-CHIP, 3000-DSFTP
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Pbfree Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ONSEMI | |
Part Package Code | 10 PIN FLIP-CHIP | |
Package Description | MICROBUMP-10 | |
Pin Count | 10 | |
Manufacturer Package Code | 489AA | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
Factory Lead Time | 2 Days | |
Samacsys Manufacturer | onsemi | |
Analog IC - Other Type | SPDT | |
JESD-30 Code | R-PBGA-B10 | |
JESD-609 Code | e1 | |
Length | 1.965 mm | |
Moisture Sensitivity Level | 1 | |
Number of Channels | 1 | |
Number of Functions | 2 | |
Number of Terminals | 10 | |
Off-state Isolation-Nom | 65 dB | |
On-state Resistance Match-Nom | 0.06 Ω | |
On-state Resistance-Max (Ron) | 1 Ω | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Output | SEPARATE OUTPUT | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | VFBGA | |
Package Equivalence Code | BGA10,3X4,20 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 0.65 mm | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 1.8 V | |
Supply Voltage-Nom (Vsup) | 3 V | |
Surface Mount | YES | |
Switch-off Time-Max | 50 ns | |
Switch-on Time-Max | 60 ns | |
Switching | BREAK-BEFORE-MAKE | |
Technology | CMOS | |
Temperature Grade | MILITARY | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 0.5 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 1.465 mm |