There are no models available for this part yet.
Overview of NM27LV512L200 by National Semiconductor Corporation
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
CAD Models for NM27LV512L200 by National Semiconductor Corporation
Part Data Attributes for NM27LV512L200 by National Semiconductor Corporation
|
|
|
|---|---|
|
Rohs Code
|
No
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
NATIONAL SEMICONDUCTOR CORP
|
|
Package Description
|
WQCCN, LCC32,.45X.55
|
|
Reach Compliance Code
|
unknown
|
|
ECCN Code
|
EAR99
|
|
HTS Code
|
8542.32.00.61
|
|
Access Time-Max
|
200 ns
|
|
I/O Type
|
COMMON
|
|
JESD-30 Code
|
R-CQCC-N32
|
|
JESD-609 Code
|
e0
|
|
Length
|
13.97 mm
|
|
Memory Density
|
524288 bit
|
|
Memory IC Type
|
UVPROM
|
|
Memory Width
|
8
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
32
|
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Number of Words
|
65536 words
|
|
Number of Words Code
|
64000
|
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Operating Mode
|
ASYNCHRONOUS
|
|
Operating Temperature-Max
|
70 °C
|
|
Operating Temperature-Min
|
|
|
Organization
|
64KX8
|
|
Output Characteristics
|
3-STATE
|
|
Package Body Material
|
CERAMIC, METAL-SEALED COFIRED
|
|
Package Code
|
WQCCN
|
|
Package Equivalence Code
|
LCC32,.45X.55
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
CHIP CARRIER, WINDOW
|
|
Parallel/Serial
|
PARALLEL
|
|
Qualification Status
|
Not Qualified
|
|
Seated Height-Max
|
3.09 mm
|
|
Standby Current-Max
|
0.00002 A
|
|
Supply Current-Max
|
0.015 mA
|
|
Supply Voltage-Max (Vsup)
|
3.6 V
|
|
Supply Voltage-Min (Vsup)
|
3 V
|
|
Supply Voltage-Nom (Vsup)
|
3.3 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
COMMERCIAL
|
|
Terminal Finish
|
TIN LEAD
|
|
Terminal Form
|
NO LEAD
|
|
Terminal Pitch
|
1.27 mm
|
|
Terminal Position
|
QUAD
|
|
Width
|
11.43 mm
|
Alternate Parts for NM27LV512L200
This table gives cross-reference parts and alternative options found for NM27LV512L200. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of NM27LV512L200, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| AM28F512-200DE | Flash, 64KX8, 200ns, CDIP32, HERMETIC SEALED, CERAMIC, DIP-32 | AMD | NM27LV512L200 vs AM28F512-200DE |
| AM28F512-90LC | Flash, 64KX8, 90ns, CQCC32, CERAMIC, LCC-32 | AMD | NM27LV512L200 vs AM28F512-90LC |
| X28C513E-12T1 | EEPROM, 64KX8, 120ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | Xicor Inc | NM27LV512L200 vs X28C513E-12T1 |
| X28C513EI-20T1 | EEPROM, 64KX8, 200ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | Xicor Inc | NM27LV512L200 vs X28C513EI-20T1 |
| AM27C512-450LC | UVPROM, 64KX8, 450ns, CMOS, CQCC32, CERAMIC, LCC-32 | AMD | NM27LV512L200 vs AM27C512-450LC |
| AM27C512-175LCB | UVPROM, 64KX8, 170ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | AMD | NM27LV512L200 vs AM27C512-175LCB |
| AM27C512-175LI | UVPROM, 64KX8, 170ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | AMD | NM27LV512L200 vs AM27C512-175LI |
| 5962-9086908MYA | 64KX8 EEPROM 5V, 120ns, CQCC32, CERAMIC, LCC-32 | Intersil Corporation | NM27LV512L200 vs 5962-9086908MYA |
| AM27C512L-150LE | UVPROM, 64KX8, 150ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | AMD | NM27LV512L200 vs AM27C512L-150LE |
| AM28F512-120DEB | Flash, 64KX8, 120ns, CDIP32, HERMETIC SEALED, CERAMIC, DIP-32 | AMD | NM27LV512L200 vs AM28F512-120DEB |