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OMAP3530ECUS72 by:

Applications Processor 423-FCCSP 0 to 90

Part Details for OMAP3530ECUS72 by Texas Instruments

Overview of OMAP3530ECUS72 by Texas Instruments

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Applications Consumer Electronics Industrial Automation Agriculture Technology Electronic Manufacturing Robotics and Drones

Price & Stock for OMAP3530ECUS72

Part # Distributor Description Stock Price Buy
DISTI # 2156-OMAP3530ECUS72-ND
DigiKey IC MPU OMAP-35XX 720MHZ 423FCBGA Min Qty: 6 Lead time: 6 Weeks Container: Bulk MARKETPLACE PRODUCT 3841
In Stock
  • 6 $50.8500
$50.8500 Buy Now
DISTI # OMAP3530ECUS72-ND
DigiKey IC MPU OMAP-35XX 720MHZ 423FCBGA Min Qty: 6 Lead time: 6 Weeks Container: Tray Temporarily Out of Stock
  • 90 $49.4173
$49.4173 Buy Now
DISTI # 595-OMAP3530ECUS72
Mouser Electronics Processors - Application Specialized Applications Proc RoHS: Compliant 0
  • 90 $49.4100
$49.4100 Order Now
Rochester Electronics OMAP 3 Arch, DSP + ARM Cortex-A8 Core, 32-Bit, 600MHz, PBGA423 RoHS: Compliant Status: Active Min Qty: 1 3841
  • 1 $51.3300
  • 25 $50.3100
  • 100 $48.2500
  • 500 $46.2000
  • 1,000 $43.6300
$43.6300 / $51.3300 Buy Now
Ameya Holding Limited IC MPU OMAP-35XX 720MHZ 423FCBGA 910
RFQ
Chip1Cloud IC MPU OMAP-35XX 720MHZ 423FCBGA 1200
RFQ
Perfect Parts Corporation   1613
RFQ

Part Details for OMAP3530ECUS72

OMAP3530ECUS72 CAD Models

OMAP3530ECUS72 Part Data Attributes

OMAP3530ECUS72 Texas Instruments
Buy Now Datasheet
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OMAP3530ECUS72 Texas Instruments Applications Processor 423-FCCSP 0 to 90
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer TEXAS INSTRUMENTS INC
Part Package Code BGA
Pin Count 423
Reach Compliance Code compliant
ECCN Code 5A992.C
HTS Code 8542.31.00.01
Samacsys Manufacturer Texas Instruments
JESD-30 Code S-PBGA-B423
JESD-609 Code e1
Length 16 mm
Moisture Sensitivity Level 4
Number of Terminals 423
Operating Temperature-Max 90 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Equivalence Code BGA423,24X24,25
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 1.4 mm
Speed 720 MHz
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 0.65 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 16 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

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