Part Details for P1010NSE5KHB by NXP Semiconductors
Overview of P1010NSE5KHB by NXP Semiconductors
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for P1010NSE5KHB
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
85AK9432
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Newark | Qoriq, 32-Bit Power Arch, Soc, 1000 Mhz, Usb, Sata, Sec, Gbe, Pcie, Ddr3, Trusted Boot, 0-105C, r2.01/ Tray Rohs Compliant: Yes |Nxp P1010NSE5KHB RoHS: Compliant Min Qty: 420 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$58.8400 | Buy Now |
DISTI #
P1010NSE5KHB
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Avnet Americas | MPU QorIQ P1010 RISC 32Bit 1000MHz 425-Pin TE-BGA I Each - Trays (Alt: P1010NSE5KHB) RoHS: Compliant Min Qty: 6 Package Multiple: 1 Lead time: 4 Weeks, 0 Days Container: Tray | 16 Partner Stock |
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RFQ | |
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Rochester Electronics | P1010 - QorIQ RISC Microprocessor, Power Architecture, 32-Bit RoHS: Compliant Status: Obsolete Min Qty: 1 | 16 |
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$55.6700 / $65.5000 | Buy Now |
Part Details for P1010NSE5KHB
P1010NSE5KHB CAD Models
P1010NSE5KHB Part Data Attributes
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P1010NSE5KHB
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
P1010NSE5KHB
NXP Semiconductors
IC,MICROPROCESSOR,32-BIT,CMOS,BGA,425PIN,PLASTIC
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | TEBGA-1-425 | |
Reach Compliance Code | unknown | |
ECCN Code | 5A002.A.1 | |
HTS Code | 8542.31.00.01 | |
Factory Lead Time | 4 Weeks | |
Samacsys Manufacturer | NXP | |
Address Bus Width | 16 | |
Bit Size | 32 | |
Boundary Scan | YES | |
Clock Frequency-Max | 100 MHz | |
External Data Bus Width | 32 | |
Format | FIXED POINT | |
Integrated Cache | YES | |
JESD-30 Code | S-PBGA-B425 | |
JESD-609 Code | e2 | |
Length | 19 mm | |
Low Power Mode | NO | |
Moisture Sensitivity Level | 3 | |
Number of DMA Channels | 4 | |
Number of External Interrupts | 4 | |
Number of Terminals | 425 | |
Operating Temperature-Max | 105 °C | |
Operating Temperature-Min | ||
Package Body Material | PLASTIC/EPOXY | |
Package Code | FBGA | |
Package Equivalence Code | BGA425,23X23,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.9 mm | |
Speed | 1000 MHz | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 0.95 V | |
Supply Voltage-Nom | 1 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Finish | TIN SILVER | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 19 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |