Part Details for P1010NSN5HFA by NXP Semiconductors
Overview of P1010NSN5HFA by NXP Semiconductors
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- Number of Functional Equivalents:
- Part Data Attributes
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Price & Stock for P1010NSN5HFA
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
4376454
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Farnell | MICROPROCESSORS IC'S RoHS: Compliant Min Qty: 1 Lead time: 3 Weeks, 1 Days Container: Each | 480 |
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$50.4239 | Buy Now |
|
Flip Electronics | Stock | 15 |
|
RFQ |
Part Details for P1010NSN5HFA
P1010NSN5HFA CAD Models
P1010NSN5HFA Part Data Attributes
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P1010NSN5HFA
NXP Semiconductors
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Datasheet
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P1010NSN5HFA
NXP Semiconductors
IC,MICROPROCESSOR,32-BIT,CMOS,BGA,425PIN,PLASTIC
|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | TEBGA-1-425 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.31.00.01 | |
Factory Lead Time | 4 Weeks | |
Address Bus Width | 16 | |
Boundary Scan | YES | |
External Data Bus Width | 32 | |
Format | FIXED POINT | |
Integrated Cache | YES | |
JESD-30 Code | S-PBGA-B425 | |
JESD-609 Code | e2 | |
Length | 19 mm | |
Low Power Mode | NO | |
Moisture Sensitivity Level | 3 | |
Number of DMA Channels | 4 | |
Number of External Interrupts | 4 | |
Number of Terminals | 425 | |
Operating Temperature-Max | 105 °C | |
Operating Temperature-Min | ||
Package Body Material | PLASTIC/EPOXY | |
Package Code | FBGA | |
Package Equivalence Code | BGA425,23X23,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.9 mm | |
Speed | 800 MHz | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 0.95 V | |
Supply Voltage-Nom | 1 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Finish | Tin/Silver (Sn/Ag) | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 19 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |