Part Details for P1011NSE2FFB by NXP Semiconductors
Overview of P1011NSE2FFB by NXP Semiconductors
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Healthcare
Renewable Energy
Robotics and Drones
Price & Stock for P1011NSE2FFB
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
85AK9447
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Newark | Qoriq, Power Arch 32-Bit Soc, 667Mhz, Gbe, Ddr2/3 W/Ecc, Pcie, Usb, Tdm, Sec, 0 To 125C, Rev 1.1/ Tray Rohs Compliant: Yes |Nxp P1011NSE2FFB RoHS: Compliant Min Qty: 27 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$57.1000 / $61.4500 | Buy Now |
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DISTI #
P1011NSE2FFB
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Avnet Americas | MPU Power Architecture RISC 32-Bit 667MHz 689-Pin PBGA - Trays (Alt: P1011NSE2FFB) RoHS: Compliant Min Qty: 6 Package Multiple: 1 Lead time: 4 Weeks, 0 Days Container: Tray | 162 Partner Stock |
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$54.0392 / $62.3194 | Buy Now |
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Rochester Electronics | QorIQ, Power Arch 32-Bit SoC, 667MHz, GbE, DDR2/3 w/ECC, PCIe, USB, TDM, SEC, 0 to 125C, Rev 1.1 RoHS: Compliant Status: Obsolete Min Qty: 1 | 162 |
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$54.0200 / $63.5600 | Buy Now |
Part Details for P1011NSE2FFB
P1011NSE2FFB CAD Models
P1011NSE2FFB Part Data Attributes
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P1011NSE2FFB
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
P1011NSE2FFB
NXP Semiconductors
RISC PROCESSOR
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | TEBGA2-689 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.1 | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 4 Weeks | |
| Samacsys Manufacturer | NXP | |
| Address Bus Width | 16 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| External Data Bus Width | 32 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B689 | |
| Length | 31 mm | |
| Low Power Mode | NO | |
| Moisture Sensitivity Level | 3 | |
| Number of DMA Channels | 4 | |
| Number of External Interrupts | 7 | |
| Number of Terminals | 689 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA689,29X29,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 2.46 mm | |
| Speed | 667 MHz | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 0.95 V | |
| Supply Voltage-Nom | 1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 31 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |