Part Details for P1013NXN2EFB by NXP Semiconductors
Overview of P1013NXN2EFB by NXP Semiconductors
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for P1013NXN2EFB
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
85AK9464
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Newark | Qoriq, 32 Bit Power Arch Soc, 600Mhz, Gbe, Pcie, Usb, Ddr2/3, Ecc, Lcd, -40 To 125C, Rev 2/ Tray Rohs Compliant: Yes |Nxp P1013NXN2EFB RoHS: Compliant Min Qty: 27 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$71.5300 / $77.1200 | Buy Now |
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DISTI #
P1013NXN2EFB
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Avnet Americas | MPU QorIQ RISC 32-Bit 600MHz 1.5V/1.8V/2.5V/3.3V 689-Pin TEPBGA II Tray - Trays (Alt: P1013NXN2EFB) RoHS: Compliant Min Qty: 6 Package Multiple: 1 Lead time: 0 Weeks, 2 Days Container: Tray | 2696 Partner Stock |
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$107.2848 / $123.7236 | Buy Now |
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Flip Electronics | Stock, ship today | 2696 |
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RFQ |
Part Details for P1013NXN2EFB
P1013NXN2EFB CAD Models
P1013NXN2EFB Part Data Attributes
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P1013NXN2EFB
NXP Semiconductors
Buy Now
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P1013NXN2EFB
NXP Semiconductors
32-BIT, 600MHz, MICROPROCESSOR, PBGA689
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | 31 X 31 MM, 2.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, TEBGA-689 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 2 Days | |
| Samacsys Manufacturer | NXP | |
| Address Bus Width | ||
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 133 MHz | |
| External Data Bus Width | ||
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B689 | |
| JESD-609 Code | e2 | |
| Length | 31 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 689 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 2.46 mm | |
| Speed | 600 MHz | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 0.95 V | |
| Supply Voltage-Nom | 1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Finish | Tin/Silver (Sn/Ag) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 31 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR |