Part Details for P4C187L-25DM by Pyramid Semiconductor Corporation
Overview of P4C187L-25DM by Pyramid Semiconductor Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (7 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for P4C187L-25DM
P4C187L-25DM CAD Models
P4C187L-25DM Part Data Attributes:
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P4C187L-25DM
Pyramid Semiconductor Corporation
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Datasheet
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P4C187L-25DM
Pyramid Semiconductor Corporation
Standard SRAM, 64KX1, 25ns, CMOS, CDIP22, 0.300 INCH, CERDIP-22
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | PYRAMID SEMICONDUCTOR CORP | |
| Part Package Code | DIP | |
| Package Description | 0.300 INCH, CERDIP-22 | |
| Pin Count | 22 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 25 ns | |
| I/O Type | SEPARATE | |
| JESD-30 Code | R-GDIP-T22 | |
| JESD-609 Code | e0 | |
| Length | 27.559 mm | |
| Memory Density | 65536 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 22 | |
| Number of Words | 65536 words | |
| Number of Words Code | 64000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 64KX1 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | DIP | |
| Package Equivalence Code | DIP22,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.715 mm | |
| Standby Current-Max | 0.0006 A | |
| Standby Voltage-Min | 2 V | |
| Supply Current-Max | 0.155 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 7.62 mm |
Alternate Parts for P4C187L-25DM
This table gives cross-reference parts and alternative options found for P4C187L-25DM. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of P4C187L-25DM, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| P4C187L-25CMB | Standard SRAM, 64KX1, 25ns, CMOS, CDIP22, 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-22 | Pyramid Semiconductor Corporation | P4C187L-25DM vs P4C187L-25CMB |
| P4C187L-25CC | Standard SRAM, 64KX1, 25ns, CMOS, CDIP22, 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-22 | Pyramid Semiconductor Corporation | P4C187L-25DM vs P4C187L-25CC |
| FT6187L-25CMB | Standard SRAM, 64KX1, 25ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22 | Force Technologies Ltd | P4C187L-25DM vs FT6187L-25CMB |
| P4C187L-25PM | Standard SRAM, 64KX1, 25ns, CMOS, PDIP22, 0.300 INCH, PLASTIC, DIP-22 | Pyramid Semiconductor Corporation | P4C187L-25DM vs P4C187L-25PM |
| FT6187L-25CM | Standard SRAM, 64KX1, 25ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22 | Force Technologies Ltd | P4C187L-25DM vs FT6187L-25CM |
| FT6187L-25DM | Standard SRAM, 64KX1, 25ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22 | Force Technologies Ltd | P4C187L-25DM vs FT6187L-25DM |
| P4C187L-25DC | Standard SRAM, 64KX1, 25ns, CMOS, CDIP22, 0.300 INCH, CERDIP-22 | Pyramid Semiconductor Corporation | P4C187L-25DM vs P4C187L-25DC |