Part Details for PXAG37KFBD,157 by NXP Semiconductors
Overview of PXAG37KFBD,157 by NXP Semiconductors
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- Number of Functional Equivalents:
- Part Data Attributes
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Price & Stock for PXAG37KFBD,157
| Part # | Distributor | Description | Stock | Price | Buy | |
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Rochester Electronics | IC MCU 16BIT 32KB OTP 44LQFP RoHS: Compliant Status: Obsolete Min Qty: 1 | 480 |
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$14.1400 / $16.6300 | Buy Now |
Part Details for PXAG37KFBD,157
PXAG37KFBD,157 CAD Models
PXAG37KFBD,157 Part Data Attributes
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PXAG37KFBD,157
NXP Semiconductors
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Datasheet
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PXAG37KFBD,157
NXP Semiconductors
IC,MICROCONTROLLER,16-BIT,XA CPU,CMOS,QFP,44PIN,PLASTIC
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.31.00.01 | |
| Bit Size | 16 | |
| CPU Family | XA | |
| JESD-30 Code | S-PQFP-G44 | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 1 | |
| Number of Terminals | 44 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP44,.47SQ,32 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| RAM (bytes) | 512 | |
| ROM (words) | 32768 | |
| ROM Programmability | UVPROM | |
| Speed | 30 MHz | |
| Supply Current-Max | 80 mA | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 30 |