Part Details for RM46L852ZWTT by Texas Instruments
Overview of RM46L852ZWTT by Texas Instruments
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for RM46L852ZWTT
RM46L852ZWTT CAD Models
RM46L852ZWTT Part Data Attributes:
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RM46L852ZWTT
Texas Instruments
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RM46L852ZWTT
Texas Instruments
16/32-Bit RISC Flash Microcontroller 337-NFBGA -40 to 105
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
Part Package Code | BGA | |
Package Description | FBGA, BGA337,19X19,32 | |
Pin Count | 337 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.31.00.01 | |
Bit Size | 32 | |
CPU Family | CORTEX-R4F | |
JESD-30 Code | S-PBGA-B337 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 337 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 105 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FBGA | |
Package Equivalence Code | BGA337,19X19,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
RAM (bytes) | 196608 | |
ROM (words) | 1310720 | |
ROM Programmability | FLASH | |
Speed | 220 MHz | |
Supply Current-Max | 360 mA | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |