Part Details for S70KL1281DABHV020 by Infineon Technologies AG
Overview of S70KL1281DABHV020 by Infineon Technologies AG
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Price & Stock for S70KL1281DABHV020
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
S70KL1281DABHV020
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Avnet Americas | DRAM Chip DDR HyperRAM 128M-Bit 16M x 8 3V 24-Pin FBGA Tray - Trays (Alt: S70KL1281DABHV020) RoHS: Compliant Min Qty: 204 Package Multiple: 1 Lead time: 0 Weeks, 2 Days Container: Tray | 3325 Partner Stock |
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$3.0504 / $3.6900 | Buy Now |
Part Details for S70KL1281DABHV020
S70KL1281DABHV020 CAD Models
S70KL1281DABHV020 Part Data Attributes
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S70KL1281DABHV020
Infineon Technologies AG
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Datasheet
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S70KL1281DABHV020
Infineon Technologies AG
Memory Circuit, 16MX8, CMOS, PBGA24,
|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
Reach Compliance Code | compliant | |
Factory Lead Time | 2 Days | |
Samacsys Manufacturer | Infineon | |
JESD-30 Code | R-PBGA-B24 | |
Length | 8 mm | |
Memory Density | 134217728 bit | |
Memory IC Type | MEMORY CIRCUIT | |
Memory Width | 8 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 24 | |
Number of Words | 16777216 words | |
Number of Words Code | 16000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 105 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 16MX8 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | VBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, VERY THIN PROFILE | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Seated Height-Max | 1 mm | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 2.7 V | |
Supply Voltage-Nom (Vsup) | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 6 mm |