Part Details for S71WS256ND0BFWYP3 by Spansion
Overview of S71WS256ND0BFWYP3 by Spansion
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for S71WS256ND0BFWYP3
| Part # | Distributor | Description | Stock | Price | Buy | |
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ComSIT USA | STACKED MCP, BURST-MODE FLASH MEMORY Memory Circuit, Flash+PSRAM, 16MX16, CMOS, PBGA84 RoHS: Not Compliant | Europe - 638 |
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RFQ |
Part Details for S71WS256ND0BFWYP3
S71WS256ND0BFWYP3 CAD Models
S71WS256ND0BFWYP3 Part Data Attributes:
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S71WS256ND0BFWYP3
Spansion
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Datasheet
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S71WS256ND0BFWYP3
Spansion
Memory Circuit, Flash+PSRAM, 16MX16, CMOS, PBGA84, 12 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SPANSION INC | |
| Part Package Code | BGA | |
| Package Description | 12 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84 | |
| Pin Count | 84 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 80 ns | |
| Additional Feature | PSRAM IS ORGANIZED AS 8M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE | |
| JESD-30 Code | R-PBGA-B84 | |
| JESD-609 Code | e1 | |
| Length | 12 mm | |
| Memory Density | 268435456 bit | |
| Memory IC Type | MEMORY CIRCUIT | |
| Memory Width | 16 | |
| Mixed Memory Type | FLASH+PSRAM | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 84 | |
| Number of Words | 16777216 words | |
| Number of Words Code | 16000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -25 °C | |
| Organization | 16MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA84,10X12,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.2 mm | |
| Standby Current-Max | 0.00007 A | |
| Supply Current-Max | 0.054 mA | |
| Supply Voltage-Max (Vsup) | 1.95 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 9 mm |