Part Details for S72XS256RE0AHBH23 by Infineon Technologies AG
Overview of S72XS256RE0AHBH23 by Infineon Technologies AG
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Transportation and Logistics
Healthcare
Renewable Energy
Automotive
Robotics and Drones
Price & Stock for S72XS256RE0AHBH23
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
S72XS256RE0AHBH23-ND
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DigiKey | IC FLASH RAM 256MBIT PAR 133FBGA Min Qty: 2200 Lead time: 52 Weeks Container: Tape & Reel (TR) | Temporarily Out of Stock |
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$4.2432 | Buy Now |
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DISTI #
S72XS256RE0AHBH23
|
Avnet Americas | FLASH, DRAM MEMORY IC 256MBIT FLASH, 256 - Tape and Reel (Alt: S72XS256RE0AHBH23) RoHS: Not Compliant Min Qty: 109 Package Multiple: 1 Lead time: 0 Weeks, 2 Days Container: Reel | 6600 Partner Stock |
|
$5.7040 / $6.9000 | Buy Now |
Part Details for S72XS256RE0AHBH23
S72XS256RE0AHBH23 CAD Models
S72XS256RE0AHBH23 Part Data Attributes
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S72XS256RE0AHBH23
Infineon Technologies AG
Buy Now
Datasheet
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Compare Parts:
S72XS256RE0AHBH23
Infineon Technologies AG
Memory Circuit, 16MX16, CMOS, PBGA133, BGA-133
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Package Description | BGA-133 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 2 Days | |
| Samacsys Manufacturer | Infineon | |
| JESD-30 Code | S-PBGA-B133 | |
| Length | 8 mm | |
| Memory Density | 268435456 bit | |
| Memory IC Type | MEMORY CIRCUIT | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Terminals | 133 | |
| Number of Words | 16777216 words | |
| Number of Words Code | 16000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 16MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Seated Height-Max | 1 mm | |
| Supply Voltage-Max (Vsup) | 1.95 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | BOTTOM | |
| Width | 8 mm |