Part Details for S80KS5122GABHM020 by Infineon Technologies AG
Overview of S80KS5122GABHM020 by Infineon Technologies AG
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Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Price & Stock for S80KS5122GABHM020
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
448-S80KS5122GABHM020-ND
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DigiKey | IC PSRAM 512MBIT HYPERBUS 24FBGA Min Qty: 1 Lead time: 10 Weeks Container: Tray |
225 In Stock |
|
$7.7877 / $10.8000 | Buy Now |
|
DISTI #
727-S5122GABHM020
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Mouser Electronics | DRAM SPCM RoHS: Compliant | 0 |
|
$7.5600 / $10.4900 | Order Now |
|
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 676 Package Multiple: 676 Container: Tray | 0Tray |
|
$7.0000 | Buy Now |
|
DISTI #
SP005674817
|
EBV Elektronik | DRAM Chip DDR SDRAM 512Mbit 64M X 8 1.8V 24-Pin FBGA Tray (Alt: SP005674817) RoHS: Compliant Min Qty: 676 Package Multiple: 676 Lead time: 1 Weeks, 4 Days | EBV - 676 |
|
Buy Now | |
|
DISTI #
3935568
|
Farnell | DRAM, AEC-Q100, 512MBIT, -40 TO 125DEG C RoHS: Compliant Min Qty: 1 Lead time: 8 Weeks, 1 Days Container: Each | 816 |
|
$19.6938 / $32.8189 | Buy Now |
Part Details for S80KS5122GABHM020
S80KS5122GABHM020 CAD Models
S80KS5122GABHM020 Part Data Attributes
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S80KS5122GABHM020
Infineon Technologies AG
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Datasheet
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S80KS5122GABHM020
Infineon Technologies AG
64MX8, CMOS, PBGA24, BGA-24
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Package Description | BGA-24 | |
| Reach Compliance Code | compliant | |
| Access Time-Max | 35 ns | |
| Clock Frequency-Max (fCLK) | 200 MHz | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PBGA-B24 | |
| Length | 8 mm | |
| Memory Density | 536870912 bit | |
| Memory IC Type | PSEUDO STATIC RAM | |
| Memory Width | 16 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 33554432 words | |
| Number of Words Code | 32000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 32MX16 | |
| Output Characteristics | 3-STATE | |
| Output Enable | NO | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VBGA | |
| Package Equivalence Code | BGA24,5X5,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, VERY THIN PROFILE | |
| Parallel/Serial | SERIAL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Screening Level | AEC-Q100 | |
| Seated Height-Max | 1 mm | |
| Standby Current-Max | 0.000035 A | |
| Standby Voltage-Min | 1.7 V | |
| Supply Current-Max | 0.044 mA | |
| Supply Voltage-Max (Vsup) | 2 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 6 mm |